μModule Manufacturing and Assembly Resources

μModule® System-in-package (SIP) products offer complete functional solutions in a single package which address development time and space constraints for markets that require complex power technology, isolation or analog system products. This system-in-package (SiP) approach streamlines the design process and reduces component count by minimizing the need to add external components.

Guidelines for Successful Assembly

The SIP integration of the integrated circuit die, power transistors, resistors, capacitors, inductors and/or transformers results in a highly reliable product when correctly applied in an application. Proper μModule handling before and during the assembly process prevents damage to the SIP structure which results in a long and reliable product lifetime.

The following guidelines and resources are available to assist in developing an appropriate design and assembly process.

Package & Board Level Reliability

Analog Devices is committed to continuously improving its world-class product reliability levels and has some of the highest reliability standards in the industry

µModule LGA and BGA Packaging Care and Assembly Instructions

A brief reference on handling moisture sensitivity, reflow and assembly for the LGA and BGA packages

Assembly Considerations for µModule® BGA and LGA Packages

Discover a complete guide to: