MAX8581
PRODUCTION2.5MHz/1.5MHz Step-Down Converters with 60mΩ Bypass in TDFN for CDMA PA Power
Overall Smallest Solution 1.5MHz Step-Down DC-DC Converters Deliver 600mA with Up to 94% Efficiency in a Small TDFN Package
- Part Models
- 2
- 1ku List Price
- Starting From $2.79
Overview
- 600mA Step-Down Converter
- 60mΩ (typ) Bypass Mode with Integrated FET
- Dynamically Adjustable Output from 0.4V to VIN
- 2.5MHz and 1.5MHz Switching Frequency
- Small LC Components: 1.5µH to 3.3µH and 2.2µF
- Up to 94% Efficiency
- Low Output Ripple at All Loads
- 2.7V to 5.5V Input
- 0.1µA Shutdown Mode
- Output Short-Circuit Protection
- Thermal Shutdown
- 10-Pin, 3mm x 3mm TDFN Packages
The MAX8581/MAX8582 high-frequency step-down converters are optimized for dynamically powering the power amplifier (PA) in CDMA handsets. They integrate a high-efficiency PWM step-down converter for medium- and low-power transmission and a 60mΩ (typ) bypass mode to power the PA directly from the battery during high-power transmission. They use an analog input driven by an external DAC to control the output voltage linearly for continuous PA power adjustment. The MAX8581/MAX8582 use an internal feedback network, and the switching frequency is internally set to 2.5MHz and 1.5MHz, respectively.
Fast switching (up to 2.5MHz) and fast soft-start allowthe use of ceramic 2.2µF input and output capacitors while maintaining low voltage ripple. The small 1.5µH to 3.3µH inductor size can be optimized for efficiency.
The MAX8581/MAX8582 are available in 10-pin, 3mm x3mm TDFN packages (0.8mm max height).
Applications
- WCDMA/NCDMA Cell Phones
- Wireless PDAs, Smartphones
Documentation
Data Sheet 1
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX8581ETB+ | Thin Dual Flatpack No Leads, Exposed Pad | ||
| MAX8581ETB+T | Thin Dual Flatpack No Leads, Exposed Pad |
This is the most up-to-date revision of the Data Sheet.
Software Resources
Can't find the software or driver you need?
Request a Driver/SoftwareHardware Ecosystem
Evaluation Kits
MAX8582 Evaluation Kit
Latest Discussions
No discussions on MAX8581 yet. Have something to say?
Start a Discussion on EngineerZone®