ADG772
PRODUCTIONCMOS Low Power Dual 2:1 Mux/Demux USB 2.0 (480 Mbps)/USB 1.1 (12 Mbps)
- Part Models
- 2
- 1ku List Price
- Starting From $0.97
Overview
- USB 2.0 (480 Mbps) and USB 1.1 (12 Mbps) signal switching compliant
- Tiny 10-lead 1.6 mm × 1.3 mm mini LFCSP package and 12-lead 3 mm × 3 mm LFCSP package
- 2.7 V to 3.6 V single-supply operation
- Typical power consumption: <0.1 μW
- RoHS compliant
The ADG772 is a low voltage CMOS device that contains two independently selectable single-pole, double throw (SPDT) switches. It is designed as a general-purpose switch and can be used for routing both USB 1.1 and USB 2.0 signals.
This device offers a data rate of 1260 Mbps, making the part suitable for high frequency data switching. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. The ADG772 exhibits break-before-make switching action.
The ADG772 is available in a 12-lead LFCSP and a 10-lead mini LFCSP. These packages make the ADG772 the ideal solution for space-constrained applications.
Product Highlights
- 1.6 mm × 1.3 mm mini LFCSP package.
- USB 1.1 (12 Mbps) and USB 2.0 (480 Mbps) compliant.
- Single 2.7 V to 3.6 V operation.
- 1.8 V logic compatible.
- RoHS compliant.
Applications
- USB 2.0 signal switching circuits
- Cellular phones
- PDAs
- MP3 players
- Battery-powered systems
- Headphone switching
- Audio and video signal routing
- Communications systems
Documentation
Data Sheet 1
Evaluation Design File 1
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG772BCPZ-1REEL | 12-Lead LFCSP (3mm x 3mm x 0.75mm) | ||
| ADG772BCPZ-REEL7 | 10-Lead LFCSP (1.3mm x 1.6mm) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Feb 13, 2014 - 14_0038 Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines. |
||
| ADG772BCPZ-1REEL | PRODUCTION | |
|
Apr 24, 2014 - 14_0038 Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines. |
||
| ADG772BCPZ-REEL7 | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Software Resources
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Request a Driver/SoftwareTools & Simulations
LTspice
Models for the following parts are available in LTspice:
- ADG772
IBIS Model 1
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.
Evaluation Kits
ADG772 Evaluation Board