ADP8860
ADP8860
PRODUCTIONCharge Pump, 7-Channel Smart LED Driver with I2C Interface
- Part Models
- 2
- 1ku List Price
- Starting From $1.83
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Overview
- Charge pump with automatic gain selection of 1×, 1.5×, and 2× for maximum efficiency
- Up to two built-in comparator inputs with programmable modes for ambient light sensing
- Outdoor, office, and dark modes for maximum backlight power savings
- 7 independent and programmable LED drivers
- 6 drivers capable of 30 mA (maximum)
- 1 driver capable of 60 mA (maximum)
- Programmable maximum current limit (128 levels)
- Standby mode for <1μA current consumption
- Fading override
- I2C-compatible interface for all programming
- 16 programmable fade in and fade out times
- 0.1 sec to 5.5 sec
- Choose from linear, square, or cubic rates
- Dedicated reset pin and built-in power on reset (POR)
- Short-circuit, overvoltage, and overtemperature protection
- Internal soft start to limit inrush currents
- Input-to-output isolation during faults or shutdown
- Operation down to VIN = 2.5 V with undervoltage lockout (UVLO) at VIN = 2.0 V /li>
- Small wafer level chip scale package (WLCSP) or lead frame chip scale package (LFCSP)
The ADP8860 combines a programmable backlight LED charge pump driver with automatic phototransistor control. This combination allows for significant power savings because it changes the current intensity in office and dark ambient light conditions. By performing this function automatically, it eliminates the need for a processor to monitor the phototransistor.
The light intensity thresholds are fully programmable via the I2C® interface. A second phototransistor input, with dedicated comparators, improves the ambient light detection levels for various user operating conditions.
The ADP8860 allows as many as six LEDs to be independently driven up to 30 mA (maximum). A seventh LED can be driven to 60 mA (maximum). All LEDs are programmable for minimum/maximum current and fade in/out times via the I2C interface. These LEDs can also be combined into groups to reduce the processor instructions during fade in/out.
Driving this entire configuration is a two-capacitor charge pump with gains of 1×, 1.5×, and 2×. This setup is capable of driving a maximum IOUT of 240 mA from a supply of 2.5 V to 5.5 V. The device includes a variety of safety features including short-circuit, overvoltage, and overtemperature protection. These features allow easy implementation of a safe and robust design. Additionally, input inrush currents are limited via an integrated soft start combined with controlled input to output isolation.
The ADP8860 is available in two package types, either a compact 2 mm × 2.4 mm × 0.6 mm WLCSP (wafer level chip scale package) or a small LFCSP (lead frame chip scale package).
Documentation
Data Sheet 1
User Guide 2
Evaluation Design File 1
Analog Dialogue 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADP8860ACBZ-R7 | 20-Ball WLCSP (1.955m x 2.355mm) | ||
| ADP8860ACPZ-R7 | 20-Lead LFCSP (4mm x 4mm w/ EP) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
May 23, 2012 - 10_0047 TSMC Fab 10 Qualification for LD20 Process |
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| ADP8860ACBZ-R7 | PRODUCTION | |
| ADP8860ACPZ-R7 | PRODUCTION | |
|
Feb 28, 2012 - 11_0175 Shipping Changes for WLCSP Products with 8mm Carrier Tape Width |
||
| ADP8860ACBZ-R7 | PRODUCTION | |
|
Jul 25, 2017 - 17_0068 CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices |
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| ADP8860ACPZ-R7 | PRODUCTION | |
|
Jun 25, 2014 - 13_0266 Test Transfer of Select LFCSP Products to STATS ChipPAC China |
||
| ADP8860ACPZ-R7 | PRODUCTION | |
|
May 5, 2014 - 14_0020 Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines. |
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| ADP8860ACPZ-R7 | PRODUCTION | |
|
Oct 26, 2011 - 11_0020 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia. |
||
| ADP8860ACPZ-R7 | PRODUCTION | |
|
Mar 14, 2011 - 11_0045 Addition of STATSChipPAC Malaysia as an Alternate Test Site for LFCSP packages. |
||
| ADP8860ACPZ-R7 | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
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