ADG723

PRODUCTION

CMOS, Low Voltage, 4 Ω Dual SPST Switch in 3 mm × 2 mm LFCSP

Data Sheet (Rev. E) Product Selection Table

Part Models: 3
1ku List Price: Starting From $1.07

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Overview

1.8 V to 5.5 V single supply
Low on resistance flatness
−3 dB bandwidth >200 MHz
Tiny package options
8-lead MSOP
3 mm × 2 mm LFCSP (A grade)

4 Ω (max) on resistance
Fast switching times
T_ON, 20 ns
T_OFF, 10 ns
Low power consumption (<0.1 μW)
TTL/CMOS compatible

The ADG721, ADG722, and ADG723 are monolithic CMOS SPST switches. These switches are designed on an advanced submicron process that provides low power dissipation yet gives high switching speed, low on resistance, and low leakage currents. The devices are packaged in both a tiny 3 mm × 2 mm LFCSP and an MSOP, making them ideal for space-constrained applications.

The ADG721, ADG722, and ADG723 are designed to operate from a single 1.8 V to 5.5 V supply, making them ideal for use in battery-powered instruments and with the new generation of DACs and ADCs from Analog Devices, Inc.

The ADG721, ADG722, and ADG723 contain two independent single-pole/single-throw (SPST) switches. The ADG721 and ADG722 differ only in that both switches are normally open and normally closed, respectively. In the ADG723, Switch 1 is normally open and Switch 2 is normally closed.

Each switch of the ADG721, ADG722, and ADG723 conducts equally well in both directions when on. The ADG723 exhibits break-before-make switching action.

PRODUCT HIGHLIGHTS

1.8 V to 5.5 V single-supply operation.
Very low R_ON (4 Ω max at 5 V, 10 Ω max at 3 V).
Low on resistance flatness.
−3 dB bandwidth >200 MHz.
Low power dissipation. CMOS construction ensures low power dissipation.
8-lead MSOP and 3 mm × 2 mm LFCSP.

APPLICATIONS

USB 1.1 signal switching circuits
Cell phones
PDAs
Battery-powered systems
Communication systems
Sample hold systems
Audio signal routing
Video switching
Mechanical reed relay replacement

Part Models: 3
1ku List Price: Starting From $1.07

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADG723BRMZ	8-Lead MSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG723BRMZ-REEL	8-Lead MSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG723BRMZ-REEL7	8-Lead MSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Mar 22, 2021 - 21_0001 Addition of Amkor Philippines as an Alternate Site for Singulated MSOP and MSOP_EP
		PCN21_0001_Form Material_Report Other Qualification Results Summary
ADG723BRMZ	PRODUCTION
ADG723BRMZ-REEL	PRODUCTION
ADG723BRMZ-REEL7	PRODUCTION
Jan 26, 2016 - 15_0176 Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines
		PCN15_0176_Form Material_Report Detailed Change Description Qualification Results Summary Qualification Results Summary
ADG723BRMZ	PRODUCTION
ADG723BRMZ-REEL	PRODUCTION
ADG723BRMZ-REEL7	PRODUCTION
Jan 5, 2015 - 14_0246 Qualification of ASE Chungli, as an Alternate Assembly Site for Select MSOP Devices
		PCN14_0246_Form Material_Report Detailed Change Description Qualification Results Summary
ADG723BRMZ	PRODUCTION
ADG723BRMZ-REEL	PRODUCTION
ADG723BRMZ-REEL7	PRODUCTION
Oct 6, 2011 - 11_0024 ADG721/2/3 Branding Code and Pin Function Datasheet Correction.
		PCN11_0024_Form Material_Report Revised Datasheet Specification
ADG723BRMZ	PRODUCTION
ADG723BRMZ-REEL	PRODUCTION
ADG723BRMZ-REEL7	PRODUCTION
May 15, 2012 - 10_0006 Halogen Free Material Change for mini SOIC Products
		PCN10_0006_Form Material_Report Qualification Report Summary Qualification Report Summary
ADG723BRMZ-REEL	PRODUCTION
ADG723BRMZ-REEL7	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

SPICE Model 1

ADG723 SPICE Macro Model

Evaluation Kits

Evaluation Board for 8 lead MSOP Devices in the Switch/Mux Portfolio

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Features and Benefits

8 lead MSOP evaluation board
Clamp to allow the main device to be changed easily
Gold pin connectors to allow the addition of passive components
SMB connectors for the input/output of signals
Additional space on board to allow for prototyping

Product Details

The EVAL-8MSOPEBZ is the evaluation board for the 8 lead MSOP devices in the switch/mux portfolio which are to be purchased separately. A clamp is supplied with the board so that the device can be secured to the board without the need for soldering. This makes the board reusable for multiple devices.

The device can be clamped or soldered to the center of the evaluation board. Each pin of the device is broke out to a link that can be set to either V_DD or GND and a wire screw terminal is provided to supply V_DD and GND. SMB connectors are on the board allow for additional external signals to be supplied to the device. In addition, there is space at the top of the board available for prototyping.

Full specifications of the device under test are available in the product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.

Resources

UG-893: Evaluating the 8-Lead MSOP Devices in the Switch/Mux Portfolio (Rev.0)
11/5/2015

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