μModule Manufacturing and Assembly Resources

μModule® System-in-package (SIP) products offer complete functional solutions in a single package which address development time and space constraints for markets that require complex power technology, isolation or analog system products. This system-in-package (SiP) approach streamlines the design process and reduces component count by minimizing the need to add external components.

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Guidelines for Successful Assembly

The SIP integration of the integrated circuit die, power transistors, resistors, capacitors, inductors and/or transformers results in a highly reliable product when correctly applied in an application. Proper μModule handling before and during the assembly process prevents damage to the SIP structure which results in a long and reliable product lifetime.

The following guidelines and resources are available to assist in developing an appropriate design and assembly process.

Package & Board Level Reliability

Analog Devices is committed to continuously improving its world-class product reliability levels and has some of the highest reliability standards in the industry

µModule LGA and BGA Packaging Care and Assembly Instructions

A brief reference on handling moisture sensitivity, reflow and assembly for the LGA and BGA packages

Assembly Considerations for µModule® BGA and LGA Packages

Discover a complete guide to: