EM Models

Revolutionizing RF Design with Transition-Based Electromagnetic (EM) Models, EM-Plugs

Chip-to-PCB transition is essential in today’s high frequency RF IC performance; landing patterns, pad parasitics, trace geometries, and assembly choices/variations all influence final performance. The traditional s-parameter model approach places the reference plane at the chip boundary or 50 Ω trace, leaving the transition area inside the reference plane and preventing simulation of alternative stack-up and transition options. Overlooking proper transitions leads to poor return loss, signal-integrity issues, and multiple PCB redesigns when substrates or layouts change.

3D illustration of a microchip on a circuit board with heat sink design elements
Close-up 3D render of microchip components and heat dissipation fins on circuit board
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Analog Devices’ new EM-Plug approach overcomes these limitations by providing 3D models of the package transition region. These lightweight, modular plugs integrate with any EM solver alongside core chip s-parameters, delivering a unified, complete simulation. Unlike full EM models, which demand very high computational power running for multiple hours, EM-Plugs simulate in minutes without compromising accuracy.

 Diagram showing 3D EM-Plug input, RF-core Touchstone file, and output combining for chip performance

The transition-based, EM-Plug tool allows users to modify and capture every critical variable—landing pattern shape, substrate thickness and dielectric constant, RF trace type (coplanar, microstrip, stripline), solder paste and mask profiles, and chip-placement or bondwire choice.

Comparison of coplanar waveguide, microstrip, and stripline RF transmission line structures

Engineers can perform rapid EM sweeps and optimizations, tuning transitions, and assessing manufacturing or assembly-tolerance effects, while maintaining accuracy beyond the reach of s-parameters or full-chip encrypted models.

RF PCB design and performance graphs showing matching optimization and S-parameters vs frequency

EM-Plugs eliminate the blind spots of s-parameter methods by embedding actual transition geometries into the simulation flow. Greater confidence in high frequency RF design is achieved by closing the gap between theoretical guidelines and real-world challenges, while also enabling faster design cycles, fewer PCB iterations, and lower costs.

Visual comparison of Flip Chip SMT, Chip & Wire, and LFCSP/LGA semiconductor packaging types

All common RF IC packages (LFCSP, LGA, chip and wire, flip-chip SMT) are supported without tool lock-in.

Learn how EM-Plugs can transform your RF design process with the latest resources. Contact our team below to access the models and recieve application-specific guidance.

Find out more about the EM-Plugs