Features and Benefits

  • Ease of Use
    • Integrated RFIN/RFOUT Solution
  • Reduces System Power Consumption and OPEX
  • Reduces BOM Costs and Total Volume
    • Smaller Power Supply, Heat Sink, and Enclosure
    • Lower Back-Off Reduces Transistor Costs
  • Frequency Ranges:
    • SC2200-EVK900: 698–960MHz
    • SC2200-EVK1900: 1800–2200MHz
    • SC2200-EVK2400: 2300–2700MHz
  • Integrated Preamp and Single-Ended RF I/Os
  • Single +5V Supply Voltage
  • Dual-Path RFIN/RFOUT Linearizer
  • Fully Adaptive Correction
  • Up to 28dB ACLR and 38dB IMD Improvement (1)
  • 1.2MHz < BWSIG ≤ 60MHz

Product Details

The SC2200 evaluation kits (SC2200-EVK) provide the hardware and software graphical user interface (GUI) necessary for the evaluation of the SC2200. The SC2200 belongs to the 4th-generation family of RF PA linearizers (RFPAL) that provide increased integration and functionality over the previous generations. The SC2200 is a dual-path linearizer that is a fully-adaptive, RFIN/RFOUT predistortion linearization solution optimized for a wide range of amplifiers, power levels, and communication protocols. It supports 2G to 4G standards (FDD and TDD) from 698MHz to 2700MHz, as well as an expanded range of signal bandwidths from 60MHz down to 1.2MHz. The device accepts single-ended RF signals to eliminate baluns and features a mirrored pinout facilitating design of both paths. The SC2200 uses the PA output and input signals to adaptively generate an optimized correction function to minimize the PA’s distortion. Using RF-domain analog signal processing enables the SC2200 to operate over wide bandwidths and with very low power consumption. The dual linearizer can be used for small cell MIMO, active antennas, distributed antennas, or in systems requiring two different simplex bands.


  • Amplifier: Class A/AB, Doherty
  • Average PA Output Power Examples: Cellular Infrastructure: 27dBm to 40dBm
  • BTS Amplifiers, RRH, Booster Amplifiers, Repeaters, Small Cells, Microcells, Picocells, DAS, AAS and MIMO Systems
  • Cellular Infrastructure
  • PA Process: LDMOS, GaN, HBT, GaAs and InGaP
  • Single/Multicarrier, Multistandard: CDMA/EVDO, TD-SCDMA, WiMAX, WCDMA/HSDPA, LTE, and TD-LTE
  • Wide Range of PAs and Output Power

Applicable Parts