EVAL-ADPA1113

Product Details

The ADPA1113-EVALZ is a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader provides thermal relief to the ADPA1113 and mechanical support to the PCB. Mounting holes on the heat spreader allow it to be attached to larger heatsinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.92 mm female coaxial connectors, and their respective RF traces are of 50 Ω characteristic impedance. The ADPA1113-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA1113.

The RF traces are 50 Ω grounded coplanar waveguides, and the package ground leads connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes. The package base, along with an indium foil shim, is mechanically connected to the heat spreader using four, 0-80 × 3/16" stainless steel, socket head screws to ensure adequate electrical and thermal conduction.

The power supply decoupling capacitors shown in Figure 5 represent the configuration that was used to characterize the device. Note that it is possible to reduce the number of capacitors; however, this reduction varies by system. Instead, it is recommended to first remove or combine the largest capacitors that are farthest from the device.

Consult the ADPA1113 data sheet in conjunction with this user guide when working with the ADPA1113-EVALZ evaluation board.