ADPA9007-EVALZ
Overview
Features and Benefits
- 2-layer Rogers 4350B evaluation board with heat spreader
- End launch 2.92 mm RF connectors
- Through calibration path
Product Details
The EVAL-ADPA9007 consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader assists in providing thermal relief to the ADPA9007 and mechanical support to the PCB. The mounting holes on the heat spreader allow for attachment to larger heat sinks to improve thermal management.
The RFIN and RFOUT/VDD ports are populated by 2.92 mm female coaxial connectors, and the respective RF traces are of 50 Ω characteristic impedance. The EVAL-ADPA9007 is populated with components suitable for use over the entire operating temperature range of the ADPA9007.
The RF transmission lines are 50 Ω grounded coplanar waveguides. The package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle, to provide adequate electrical conduction and thermal conduction to the heat spreader.
The power supply decoupling capacitors shown above represent the configuration used in characterizing the device. Full details about the part are available in the ADPA9007 data sheet, which must be consulted when using the EVAL-ADPA9007.
Markets and Technologies
Applicable Parts
Package Contents
- 2-layer Rogers 4350B, EVAL-ADPA9007 evaluation board with heat spreader
System Requirements
- RF signal generator
- RF spectrum analyzer
- RF network analyzer
- 15 V, 1.0 A power supply
- 0 V to −2.0 V, 10 mA power supply
- 5 V, 100 mA power supply
- DC block, Marki Microwave, DCZM29F29 or equivalent
- Bias tee, Marki Microwave, BT20050 or equivalent
- 5 W attenuator ≥ 10 dB