MAX3229
PRODUCTION+2.5V to +5.5V RS-232 Tranceivers in UCSP
- Part Models
- 1
- 1ku List Price
- price unavailable
Overview
- 6 x 5 Chip-Scale Packaging (UCSP)
- 1µA Low-Power AutoShutdown
- 250kbps Guaranteed Data Rate
- Meets EIA/TIA-232 Specifications Down to +3.1V
- RS-232 Compatible to +2.5V Allows Operation from Single Li+ Cell
- Small 0.1µF Capacitors
- Configurable Logic Levels
The MAX3228/MAX3229 are +2.5V to +5.5V powered EIA/TIA-232 and V.28/V.24 communications interfaces with low power requirements, and high data-rate capabilities, in a chip-scale package (UCSP).
The MAX3228/MAX3229 achieve a 1µA supply current with Maxim's AutoShutdown feature. They save power without changes to existing BIOS or operating systems by entering low-power shutdown mode when the RS-232 cable is disconnected, or when the transmitters of the connected peripherals are off.
The transceivers have a proprietary low-dropout transmitter output stage, delivering RS-232 compliant performance from a +3.1V to +5.5V supply, and RS-232 compatible performance with a supply voltage as low as +2.5V. The dual charge pump requires only four small 0.1µF capacitors for operation from a +3.0V supply. Each device is guaranteed to run at data rates of 250kbps while maintaining RS-232 output levels.
The MAX3228/MAX3229 offer a separate power-supply input for the logic interface, allowing configurable logic levels on the receiver outputs and transmitter inputs. Operating over a +1.65V to VCC range, VL provides the MAX3228/MAX3229 compatibility with multiple logic families.
The MAX3229 contains one receiver and one transmitter. The MAX3228 contains two receivers and two transmitters. The MAX3228/MAX3229 are available in tiny chip-scale packaging and are specified across the extended industrial temperature range of -40°C to +85°C.
Applications
- Cell Phones
- Cellular Data Cables
- Handheld Devices
- PDAs and Other Handheld Devices
- Set-Top Boxes
Documentation
Data Sheet 1
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX3229AEEWV+ | Wafer-Level Package 5x6 Bump, Full Array |
This is the most up-to-date revision of the Data Sheet.