MAX32007
RECOMMENDED FOR NEW DESIGNSOctal 3.0Gbps DCL with Integrated Level Setting DACs, Cable Droop Compensation, and PMU switches
Industry's Fastest Octal-Channel Pin Electronics Driver
- Part Models
- 2
- 1ku List Price
- Starting From $188.26
Overview
- Low Power at High-Speed Maximizes Driver Performance
- Typical 0.89W Per Channel Power Dissipation
- 10nA Low-Leak Mode
- High-Speed Data Rate (50Ω)
- 3.0Gbps Typical at 0.1Vpp
- 2.5Gbps Typical at 0.5Vpp
- 2.4Gbps Typical at 0.75Vpp
- 1.3Gbps Typical at 1.5Vpp
- Voltage Range from -1.5V to +4.5V
- Integrated VHH Programming Mode (4th-Level Drive) up to 7.1V
- Integrated Functionality Provides Value-Add Features
- Integrated ±12mA Passive Load
- Programmable Double Time Constant Cable Droop Compensation–Drive and Receive Paths
- Digital Slew-Rate Control for EMI-Sensitive Applications
- 64 Independent 14-bit Level-Setting DACs
- 50MHz SPI Interface
The MAX32007 is a fully integrated, high performance, high speed 3Gbps octal-channel pin electronics driver that integrates multiple automatic test equipment (ATE) functions into a single IC. This DCL (driver/comparator/load) device is compatible with most high-speed logic families and includes a 4-level driver, dynamic clamps, window comparator, passive load, differential comparator, slew rate control, driver and comparator cable droop compensation, voltage clamps, PMU switches, and level-setting DACs.
The MAX32007 driver features a -1.5V to +4.5V input range, high-impedance mode, active-termination (3rd-level drive), and VHH programming (4th-level drive) up to 7.1V. The window comparators provide low timing variation over changes in slew rate, pulse width, or overdrive voltage. The MAX32007 features dynamic clamps that limit high-speed device-under-test (DUT) waveforms as well as cable droop compensation for optimization of driver and return path signals. The integrated passive load is rated for ±12mA. Configuration of the many features are done through a 50MHz SPI interface.
The MAX32007 is available in a 16mm x 10mm x 1.4mm csBGA package with exposed pad on the top for easy heat removal. The ball pitch is 0.8mm with a ball grid array of 19x12. Typical power dissipation is rated for 0.89W per channel. The MAX32007 operates over an internal die temperature range of +40°C to +100°C with a nominal operating point of +70°C. The device provides both a temperature monitor output (TSA) and an over-temp indicator (TSD).
Applications
- SoC ATE
- Memory ATE
- Digital Testers
- Burn-In Testers
- Wafer Testers
Documentation
Request an NDA
Complete documentation is available upon completion of a Non-Disclosure Agreement (NDA).
Request an NDAVideo 1
Analog Dialogue 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX32007CXP+ | CSP_BGA | ||
| MAX32007CXP+T | CSP_BGA |
Tools & Simulations
Software Development 2
Evaluation Kits
Evaluation Kit for the MAX32007