MAX3013
PRODUCTION+1.2V to +3.6V, 0.1µA, 100Mbps, 8-Channel Level Translators
100Mbps Octal, Bidirectional, Logic-Level Translator Saves 50% Board Space
- Part Models
- 4
- 1ku List Price
- Starting From $10.60
Overview
- 100Mbps Guaranteed Data Rate
- Bidirectional Level Translation
- VL Operation Down to +1.2V
- Ultra-Low 0.1µA Supply Current in Shutdown
- Low-Quiescent Current (0.1µA)
- UCSP, QFN, and TSSOP Packages
The MAX3013 8-channel level translator provides the level shifting necessary to allow 100Mbps data transfer in a multivoltage system. Externally applied voltages, VCC and VL, set the logic levels on either side of the device. Logic signals present on the VL side of the device appear as a higher voltage logic signal on the VCC side of the device, and vice-versa.
The MAX3013 features an EN input that, when at logic low, places all inputs/outputs on both sides in tristate and reduces the VCC and VL supply currents to 0.1µA. This device operates at a guaranteed data rate of 100Mbps for VL > 1.8V.
The MAX3013 accepts a VCC voltage from +1.65V to +3.6V and a VL voltage from +1.2V to (VCC - 0.4V), making it ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems. The MAX3013 is available in 5 x 4 UCSP, 20-pin 5mm x 5mm QFN, and 20-pin TSSOP packages.
Applications
- Cell Phones
- Global Positioning Systems (GPS)
- Low-Voltage ASIC Level Translation
- Portable Communication Devices
- Portable POS Systems
- SPI™ and MICROWIRE™ Level Translation
- Telecommunications Equipment
Documentation
Data Sheet 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX3013ETP+ | LFCSP | ||
| MAX3013ETP+T | LFCSP | ||
| MAX3013EUP+ | Thin Shrink Small-Outline Package | ||
| MAX3013EUP+T | Thin Shrink Small-Outline Package |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Jun 20, 2016 - 1612 ASSEMBLY |
||
| MAX3013ETP+ | PRODUCTION | |
| MAX3013ETP+T | PRODUCTION | |
|
Dec 8, 2016 - 1613_ERRATA ASSEMBLY |
||
| MAX3013EUP+ | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Hardware Ecosystem
Tools & Simulations
IBIS Model 1
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