LTC1484
PRODUCTIONLow Power RS485 Transceiver with Receiver Fail-Safe
- Part Models
- 8
- 1ku List Price
- Starting From $2.33
Overview
- No Damage or Latchup to ±15kV ESD (Human Body Model), IEC-1000-4-2 Level 4 Contact (±8kV) and Level 3 (±8kV) Air Gap Specifications
- Guaranteed High Receiver Output State for Floating, Shorted or Terminated Inputs with No Signal Present
- Drives Low Cost Residential Telephone Wires
- Low Power: ICC = 700μA Max with Driver Disabled
- ICC = 900μA Max for Driver Enable with No Load
- 20μA Max Quiescent Current in Shutdown Mode
- Single 5V Supply
- -7V to 12V Common Mode Range Permits ±7V Ground Difference Between Devices on the Data Line
- Power Up/Down Glitch-Free Driver Outputs
- Up to 32 Transceivers on the Bus
- Pin Compatible with the LTC485
- Available in 8-Lead MSOP, PDIP and SO Packages
The LTC1484 is a low power RS485 compatible transceiver. In receiver mode, it offers a fail-safe feature which guarantees a high receiver output state when the inputs are left open, shorted together or terminated with no signal present. No external components are required to ensure the high receiver output state.
Both driver and receiver feature three-state outputs with separate receiver and driver control pins. The driver outputs maintain high impedance over the entire common mode range when three-stated. Excessive power dissipation caused by bus contention or faults is prevented by a thermal shutdown circuit that forces the driver outputs into a high impedance state.
Enhanced ESD protection allows the LTC1484 to withstand ±15kV (human body model), IEC-1000-4-2 level 4 (±8kV) contact and level 3 (±8kV) air discharge ESD without latchup or damage.
The LTC1484 is fully specified over the commercial and industrial temperature ranges and is available in 8-lead MSOP, PDIP and SO packages.
Applications
- Battery-Powered RS485/RS422 Applications
- Low Power RS485/RS422 Transceiver
- Level Translator
Documentation
Data Sheet 1
Reliability Data 1
User Guide 1
Video 1
Product Selector Card 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| LTC1484CMS8#PBF | 8-Lead MSOP | ||
| LTC1484CMS8#TRPBF | 8-Lead MSOP | ||
| LTC1484CN8#PBF | 8-Lead PDIP (Narrow 0.3 Inch) | ||
| LTC1484CS8#PBF | 8-Lead SOIC (Narrow 0.15 Inch) | ||
| LTC1484CS8#TRPBF | 8-Lead SOIC (Narrow 0.15 Inch) | ||
| LTC1484IN8#PBF | 8-Lead PDIP (Narrow 0.3 Inch) | ||
| LTC1484IS8#PBF | 8-Lead SOIC (Narrow 0.15 Inch) | ||
| LTC1484IS8#TRPBF | 8-Lead SOIC (Narrow 0.15 Inch) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Oct 11, 2022 - 22_0244 Epoxy Change from Henkel 8290 to 8290A for MSOP Package |
||
| LTC1484CMS8#PBF | PRODUCTION | |
| LTC1484CMS8#TRPBF | PRODUCTION | |
|
Apr 18, 2022 - 22_0050 UTAC Thai Limited (UTL) as Alternate Assembly Site for MSOP Packages / Devices |
||
| LTC1484CMS8#PBF | PRODUCTION | |
| LTC1484CMS8#TRPBF | PRODUCTION | |
|
Feb 3, 2020 - 20_0128 Laser Top Mark for 8 Lead MSOP Packages Assembled in ADPG and UTAC |
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| LTC1484CMS8#PBF | PRODUCTION | |
| LTC1484CMS8#TRPBF | PRODUCTION | |
|
Oct 8, 2024 - 24_0234 Migrating Bottom Trace Code Marking to Top Side Laser Marking for PDIP Package |
||
| LTC1484CN8#PBF | PRODUCTION | |
| LTC1484IN8#PBF | PRODUCTION | |
|
Oct 11, 2022 - 22_0241 Epoxy Change from Henkel 8290 to 8290A for PDIP Package |
||
| LTC1484CN8#PBF | PRODUCTION | |
| LTC1484IN8#PBF | PRODUCTION | |
|
Aug 6, 2022 - 22_0172 Laser Top Mark Conversion for PDIP Packages Assembled in ADPG [PNG] |
||
| LTC1484CN8#PBF | PRODUCTION | |
| LTC1484IN8#PBF | PRODUCTION | |
|
Oct 24, 2024 - 24_0246 Migrating Bottom Trace Code Marking to Top Side Laser Marking for SOIC_N Package |
||
| LTC1484CS8#PBF | PRODUCTION | |
| LTC1484CS8#TRPBF | PRODUCTION | |
|
Oct 12, 2022 - 22_0255 Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 2 of 2) |
||
| LTC1484CS8#PBF | PRODUCTION | |
| LTC1484CS8#TRPBF | PRODUCTION | |
|
Jun 16, 2021 - 21_0026 Laser Top Mark for 8SOICN Assembled in ADPG, UTL and CRM |
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| LTC1484CS8#PBF | PRODUCTION | |
| LTC1484CS8#TRPBF | PRODUCTION | |
| LTC1484IS8#PBF | PRODUCTION | |
| LTC1484IS8#TRPBF | PRODUCTION | |
|
Dec 14, 2023 - 22_0255 Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 2 of 2) |
||
| LTC1484IS8#PBF | PRODUCTION | |
| LTC1484IS8#TRPBF | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Hardware Ecosystem
| Parts | Product Life Cycle | Description |
|---|---|---|
| Interface Transceivers 1 | ||
| LTM2881 | PRODUCTION | Complete Isolated RS485/RS422 μModule Transceiver + Power |