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HMC850 Data Sheet4/22/2015PDF1 M
HMC850
28 Gbps 1:2 Fanout Buffer with Programmable Output Voltage
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Overview
Features and Benefits
- Inputs Terminated Internally to 50 Ohms
- Differential Inputs are DC Coupled
- Propagation Delay: 75 ps
- Fast Rise and Fall Times: 16/15 ps
- Programmable Differential Output Voltage Swing: 600 - 1100 mV
- Power Dissipation: 315 mW
- 16 Lead Ceramic 3×3mm SMT Package: 9mm2
Product Details
The HMC850LC3 is a 1:2 Fanout Buffer designed to support data transmission rates up to 28 Gbps, and clock frequencies as high as 20 GHz. All differential inputs and outputs are DC coupled and terminated on chip with 50 Ω resistors to the positive supply, ground. The outputs may be used in either single-ended or differential modes, and should be AC or DC coupled into 50 Ω resistors connected to ground.
The HMC850LC3 also features an output level control pin, VR which allows for loss compensation or for signal level optimization. The HMC850LC3 operates from a single -3.3V DC supply and is available in a ceramic RoHS compliant 3×3 mm SMT package.
APPLICATIONS
- RF ATE Applications
- Broadband Test & Measurement
- Serial Data Transmission up to 28 Gbps
- Clock Buffering up to 20 GHz
Product Categories
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
Documentation & Resources
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RF, Microwave, and Millimeter Wave Product Selection Guide7/13/2018PDF9M
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Package/Assembly Qualification Test Report: LC3, LC3B, LC3C (QTR: 2014-00376 REV: 01)10/29/2015PDF825 K
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Semiconductor Qualification Test Report: BiCMOS-C (QTR: 2013-00241)10/29/2015PDF781 K
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HMC Legacy PDN: PCN08110034/27/2012PDF399 K
Tools & Simulations
IBIS Models
IBS
HMC850 IBIS Model
38.79 K
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC850LC3 | Material Declaration | Reliability Data | 16-Lead LCC (3mm x 3mm w/ EP) | |
| HMC850LC3TR | Material Declaration | Reliability Data | 16-Lead LCC (3mm x 3mm w/ EP) | |
| HMC850LC3TR-R5 | Material Declaration | Reliability Data | 16-Lead LCC (3mm x 3mm w/ EP) | |
| Wafer Fabrication Data |
Sample & Buy
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List Pricing
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Lead Times
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Sampling
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Evaluation Boards
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.