Overview
Features and Benefits
- Operation up to 28.3 Gbps
- Low DC Power Dissipation, 0.12W for 1.5VP-P swing @ 3.3V supply 0.50W for 2.3Vpp swing @ 6V supply
- Adjustable Output Amplitude from 1.2VP-P to 2.3VP-P
- 16 Lead 3x3mm SMT Package: <9 mm2
Product Details
The HMC7150 is a broadband driver amplifier for electro-absorption modulated lasers (EML) and supports data-rates up to 28.3Gbps to meet the 100Gb Ethernet system requirements. The part provides the module designers scalable power dissipation for varying drive voltage characteristics of different modulators and the power consumption of the module can be set as low as 0.12W to 0.5W at 1.5VP-P and 2.3VP-P outputs amplitudes, respectively. The HMC7150 supports wide range of supply voltages from 3.3V to 6V and delivering excellent time domain performance. The output amplitude and cross-point can be adjusted via control pins. The input and output are 50 Ohms matched and used AC coupled. The HMC7150 is in compact leadless 3x3mm surface mountable package.
APPLICATIONS
- 100Gb Ethernet ER4/ LR4 systems
- CFP/CFP2/CFP4 or similar form factor modules
- Optical transceivers and pluggable modules
- Broadband gain stages and pre-amplifiers
- Broadband Test & Measurement Equipment
Product Categories
To request data sheet and for additional information, please contact RFMG-fo@analog.com
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
Documentation & Resources
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC7150LP3DE | Material Declaration | Reliability Data | LFCSP:LEADFRM CHIP SCALE | |
| HMC7150LP3DETR | Material Declaration | Reliability Data | LFCSP:LEADFRM CHIP SCALE | |
| Wafer Fabrication Data |
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