Features and Benefits
- 1024-Byte Nonimprinting Key Memory with High- Speed Erase
- 64-Byte General-Purpose RAM (Not Cleared)
- Real-Time Clock with Leap Year Compensation Valid Up to 2100
- Watchdog Timer
- CPU Supervisor
- Four General-Purpose Tamper-Detect Comparators with Associated Reference
- Three Tamper-Detect Logic Inputs
- On-Chip Programmable Temperature Sensing with Proprietary Rate-of-Change Detector
- On-Chip Random Number Generator (RNG)
- Latching and Time Stamping of Tamper Events
- Crystal Oscillator Tamper Monitoring
- Low Power Consumption
- 3.0V to 3.6V Single-Supply Operation
- CSBGA Package with No Horizontally Exposed Leads
The device includes a real-time clock (RTC), CPU supervisor, watchdog timer, and on-chip temperature sensor. In the event of a primary power failure, an external battery source is automatically switched in to keep the key memory, RTC, and tamper-detection circuitry active. The DS3640 provides low-leakage tamper-detection inputs for interface to external sensors, interlocks, and anti-tamper meshes. The DS3640 will also invoke a tamper event if the backup battery drops below a specified threshold, absolute temperature or temperature rate-of-change exceeds programmed limits, or crystal-oscillator frequency falls outside a specified window. The tamper event is latched and time stamped for future debugging purposes.
Access to the RTC, tamper monitoring, key memory, and device configuration is conducted through an I²C-compatible interface. The DS3640 is assembled in a Pb-free BGA package, which enhances key security in that the leads are not exposed to the outer edges of the package.
- Alarm Systems
- IT Security
- Point-of-Sale Terminals
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
DS3640 Reliability Data1/12/202320K
Embedded Security Going Forward1/30/2007
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|DS3640B+||Material Declaration||Reliability Data||Chip-Scale Ball-Grid Array|
|DS3640B+TRL||Material Declaration||Reliability Data||Chip-Scale Ball-Grid Array|
|Wafer Fabrication Data||DS3640 Reliability Data|
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