ADuM2250
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ADuM2250

Hot-Swappable Dual I2C® Isolators, 5 kV

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 6
1ku List Price Starting From $3.69
Features
  • Bidirectional I2C communication
  • Open-drain interfaces
  • Suitable for hot swap applications
  • 30 mA current sink capability
  • 1000 KHz operation
  • 3.0 V to 5.5 V supply/logic levels
  • 16-lead SOIC wide body package version (RW-16)
  • High temperature operation: 105°C
  • 16-lead SOIC wide body enhanced creepage version (RI-16-2
  • Safety and regulatory approvals
  • UL recognition: 5000 V rms for 1 minute per UL 1577
  • 5000 V rms for 1 minute per UL 1577
  • CSA Component Acceptance Notice 5A (RI-16-2 package)
Additional Details
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The ADuM2250 / ADuM2251 are hot swappable digital isolators with nontlatching, bidirectional communication channels and are compatible with I2C interfaces. This eliminates the need for splitting I2C signals into separate transmit and receive signals for use with stand-alone optocouplers.

The ADuM2250 provides two bidirectional channels, supporting a complete isolated I2C interface. The ADuM2251 provides one bidirectional channel and one unidirectional channel for those applications where a bidirectional clock is not required.

The ADuM2250 / ADuM2251 contain hot swap circuitry to prevent data glitches when an unpowered card is inserted onto an active bus.

These isolators are based on iCoupler® chip scale transformer technology from Analog Devices, Inc. iCoupler is a magnetic isolation technology with functional, performance, size, and power consumption advantages compared to optocouplers. The ADuM2250 / ADuM2251 integrate iCoupler channels with semiconductor circuitry to enable a complete, isolated I2C interface provided in a small form factor package.

APPLICATIONS

  • Isolated I2C, SMbus, or PMBus Interfaces
  • Multilevel I2C interfaces
  • Power supplies
  • Networking
  • Power over Ethernet
Part Models 6
1ku List Price Starting From $3.69

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Documentation

Documentation

Video

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
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Product Lifecycle

PCN

Sep 22, 2015

- 15_0135

Alternate Assembly Site of Select Isolator Products in 8L/16L SOIC_N, 16L/20L SOIC_W and 16L/20L SOIC_IC at ASE Chungli

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PRODUCTION

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PRODUCTION

Nov 19, 2013

- 13_0109

Notification of qualification of Alternate Fab Foundry at ADI Limerick for TC die in Isolation products.

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PRODUCTION

ADUM2250ARWZ

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PRODUCTION

Nov 6, 2013

- 13_0283

Change of Moisture Sensitivity Level Rating for iCoupler Products Assembled in an RI-16 Package from MSL 1 to MSL 3

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PRODUCTION

Dec 18, 2012

- 12_0228

ADuM125x/ADuM225x Die Revision

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ADUM2250ARIZ-RL

PRODUCTION

ADUM2250ARWZ

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ADUM2250ARWZ-RL

PRODUCTION

Feb 27, 2012

- 11_0066

Qualification of Alternate Fab Foundry Gold Plating Process Site for Isolation Products at ADI Limerick.

ADUM2250ARIZ

PRODUCTION

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PRODUCTION

ADUM2250ARWZ

PRODUCTION

ADUM2250ARWZ-RL

PRODUCTION

Apr 27, 2016

- 15_0135

Alternate Assembly Site of Select Isolator Products in 8L/16L SOIC_N, 16L/20L SOIC_W and 16L/20L SOIC_IC at ASE Chungli

Filter by Model

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Reset Filters

Part Models

Product Lifecycle

PCN

Sep 22, 2015

- 15_0135

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Alternate Assembly Site of Select Isolator Products in 8L/16L SOIC_N, 16L/20L SOIC_W and 16L/20L SOIC_IC at ASE Chungli

ADUM2250ARIZ

PRODUCTION

ADUM2250ARIZ-RL

PRODUCTION

ADUM2250ARWZ

PRODUCTION

ADUM2250ARWZ-RL

PRODUCTION

Nov 19, 2013

- 13_0109

arrow down

Notification of qualification of Alternate Fab Foundry at ADI Limerick for TC die in Isolation products.

ADUM2250ARIZ

PRODUCTION

ADUM2250ARIZ-RL

PRODUCTION

ADUM2250ARWZ

PRODUCTION

ADUM2250ARWZ-RL

PRODUCTION

Nov 6, 2013

- 13_0283

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Change of Moisture Sensitivity Level Rating for iCoupler Products Assembled in an RI-16 Package from MSL 1 to MSL 3

ADUM2250ARIZ

PRODUCTION

ADUM2250ARIZ-RL

PRODUCTION

Dec 18, 2012

- 12_0228

arrow down

ADuM125x/ADuM225x Die Revision

ADUM2250ARIZ

PRODUCTION

ADUM2250ARIZ-RL

PRODUCTION

ADUM2250ARWZ

PRODUCTION

ADUM2250ARWZ-RL

PRODUCTION

Feb 27, 2012

- 11_0066

arrow down

Qualification of Alternate Fab Foundry Gold Plating Process Site for Isolation Products at ADI Limerick.

ADUM2250ARIZ

PRODUCTION

ADUM2250ARIZ-RL

PRODUCTION

ADUM2250ARWZ

PRODUCTION

ADUM2250ARWZ-RL

PRODUCTION

Apr 27, 2016

- 15_0135

arrow down

Alternate Assembly Site of Select Isolator Products in 8L/16L SOIC_N, 16L/20L SOIC_W and 16L/20L SOIC_IC at ASE Chungli

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 1

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EVAL-ADuM1250

ADuM1250 Evaluation Board

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EVAL-ADuM1250

ADuM1250 Evaluation Board

ADuM1250 Evaluation Board

Features and Benefits

  • Access to two bidirectional data channels
  • Multiple connection options
  • Support for active probes
  • Provisions for cable terminations
  • Support for PCB edge mounted coaxial connectors
  • Easy configuration

Product Detail

The EVAL-ADuM1250EBZ supports two bidirectional channels for evaluation of isolated I2C interfaces in 8-lead SOIC packages. The evaluation board provides a JEDEC standard, 8-lead SOIC_N pad layout. This layout supports signal distribution, loopback, and loads referenced to the VDDx or GNDx planes, as well as optimal bypass capacitance. Signal sources can be conducted to the board through header pins or through edge mounted Sub- miniature Version A (SMA) connectors (SMA connectors must be ordered separately).

Screw terminal blocks on the evaluation board provide power connections. The board includes 200 mil (5.08 mm) header positions for compatibility with active probes (probe header pins must be ordered separately). The EVAL-ADuM1250EBZ evaluation board can be used to evaluate the ADuM1250, ADuM1251, ADuM2250, and ADuM2251 devices. Although the pad layout on the EVAL- ADuM1250EBZ does not support the ADuM2250 and ADuM2251 16-lead SOIC_W and SOIC_IC packages, these devices are functionally equivalent to the ADuM1250 and ADuM1251, respectively, for the purposes of evaluation. They differ only by package and isolation capabilities. Therefore, evaluations of the ADuM1250 and ADuM1251 can be applied to the ADuM2250 and ADuM2251 as well.

The evaluation board follows best printed circuit board (PCB) design practices for 4-layer boards, including a full power and ground plane on each side of the isolation barrier. No other electromagnetic interference (EMI) or noise mitigation design features are included on this evaluation board. For high speed operation, or when ultralow emissions are required, refer to the AN-1109 Application Note for additional evaluation board layout techniques.

Full specifications for the ADuM1250 are available in the ADuM1250 data sheet, which must be consulted in conjunction with User Guide UG-1100 when working with the evaluation board.

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