ADN2855

PRODUCTION

Multirate 155 Mbps/622 Mbps/1244 Mbps/1250 Mbps Burst Mode Clock and Data Recovery IC with Deserializerer

Data Sheet (Rev. B) Product Selection Table

Part Models: 2
1ku List Price: price unavailable

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Overview

Serial data input
- 155.52 Mbps/622.08 Mbps/1244.16 Mbps/1250.00 Mbps
12-bit acquisition time
4-bit parallel LVDS output interface
Patented dual-loop clock recovery architecture
Integrated PRBS generator
Byte rate reference clock
Loss-of-lock indicator
Supports double data rate (DDR)-compatible FPGA
I²C interface to access optional features
Single-supply operation: 3.3 V
Power
- 670 mW typical in serial output mode
- 825 mW typical in deserializer mode
5 mm × 5 mm, 32-lead LFCSP

The ADN2855 is a burst mode clock and data recovery IC designed for GPON/BPON/GEPON optical line terminal (OLT) receiver applications. The part can operate at 155.52 Mbps, 622.08 Mbps, 1244.16 Mbps, or 1250.00 Mbps data rates, selectable via the I²C interface.

The ADN2855 frequency locks to the OLT reference clock and aligns to the input data within 12 bits of the start of the preamble. The device provides a full rate or an optional half rate output clock for a double data rate (DDR) interface to an FPGA or digital ASIC.

All specifications are quoted for −40°C to +85°C ambient temperature, unless otherwise noted. The ADN2855 is available in a compact 5 mm × 5 mm, 32-lead chip scale package.

Applications

Passive optical networks
GPON/BPON/GEPON OLT receivers

Part Models: 2
1ku List Price: price unavailable

Documentation

Data Sheet 1

ADN2855: Multirate 155 Mbps/622 Mbps/1244 Mbps/1250 Mbps Burst Mode Clock and Data Recovery IC with Deserializer Data Sheet (Rev.B) 01/29/2009

Frequently Asked Question 1

FAQ 09/05/2025

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADN2855ACPZ	32-Lead LFCSP (5mm x 5mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADN2855ACPZ-R7	32-Lead LFCSP (5mm x 5mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Oct 21, 2016 - 16_0229 Assembly Transfer of Select LFCSP Products to ASE Korea
		PCN16_0229_Form Material_Report Detailed Change Description Detailed Change Description Qualification Results Summary
ADN2855ACPZ	PRODUCTION
ADN2855ACPZ-R7	PRODUCTION
May 11, 2014 - 13_0231 Assembly Transfer of Select 4x4 and 5x5mm LFCSP Products to STATS ChipPAC China.
		PCN13_0231_Form Material_Report Detailed Change Description Qualification Report Summary
ADN2855ACPZ	PRODUCTION
ADN2855ACPZ-R7	PRODUCTION
Jul 16, 2012 - 11_0020 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia.
		PCN11_0020_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Report Summary
ADN2855ACPZ	PRODUCTION
ADN2855ACPZ-R7	PRODUCTION
Feb 15, 2010 - 07_0061 LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
		Material_Report Material_Report PCN_07_0061_RevB_China PCN_07_0061_RevB_Korea PCN07_0061_Form
ADN2855ACPZ	PRODUCTION
ADN2855ACPZ-R7	PRODUCTION