ADN2855
Info: : PRODUCTION
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ADN2855

Multirate 155 Mbps/622 Mbps/1244 Mbps/1250 Mbps Burst Mode Clock and Data Recovery IC with Deserializerer

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 2
1ku List Price
price unavailable
Features
  • Serial data input
    • 155.52 Mbps/622.08 Mbps/1244.16 Mbps/1250.00 Mbps
  • 12-bit acquisition time
  • 4-bit parallel LVDS output interface
  • Patented dual-loop clock recovery architecture
  • Integrated PRBS generator
  • Byte rate reference clock
  • Loss-of-lock indicator
  • Supports double data rate (DDR)-compatible FPGA
  • I2C interface to access optional features
  • Single-supply operation: 3.3 V
  • Power
    • 670 mW typical in serial output mode
    • 825 mW typical in deserializer mode
  • 5 mm × 5 mm, 32-lead LFCSP
Additional Details
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The ADN2855 is a burst mode clock and data recovery IC designed for GPON/BPON/GEPON optical line terminal (OLT) receiver applications. The part can operate at 155.52 Mbps, 622.08 Mbps, 1244.16 Mbps, or 1250.00 Mbps data rates, selectable via the I2C interface.

The ADN2855 frequency locks to the OLT reference clock and aligns to the input data within 12 bits of the start of the preamble. The device provides a full rate or an optional half rate output clock for a double data rate (DDR) interface to an FPGA or digital ASIC.

All specifications are quoted for −40°C to +85°C ambient temperature, unless otherwise noted. The ADN2855 is available in a compact 5 mm × 5 mm, 32-lead chip scale package.

Applications

  • Passive optical networks
  • GPON/BPON/GEPON OLT receivers
Part Models 2
1ku List Price
price unavailable

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADN2855ACPZ
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ADN2855ACPZ-R7
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Product Lifecycle

PCN

Oct 21, 2016

- 16_0229

Assembly Transfer of Select LFCSP Products to ASE Korea

May 11, 2014

- 13_0231

Assembly Transfer of Select 4x4 and 5x5mm LFCSP Products to STATS ChipPAC China.

Jul 16, 2012

- 11_0020

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia.

Feb 15, 2010

- 07_0061

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Oct 21, 2016

- 16_0229

arrow down

Assembly Transfer of Select LFCSP Products to ASE Korea

May 11, 2014

- 13_0231

arrow down

Assembly Transfer of Select 4x4 and 5x5mm LFCSP Products to STATS ChipPAC China.

Jul 16, 2012

- 11_0020

arrow down

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia.

Feb 15, 2010

- 07_0061

arrow down

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Software & Part Ecosystem

Software & Part Ecosystem

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