ADN2855
ADN2855
Info: :
PRODUCTION
ADN2855
Multirate 155 Mbps/622 Mbps/1244 Mbps/1250 Mbps Burst Mode Clock and Data Recovery IC with Deserializerer
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Info: :
PRODUCTION
Info: :
PRODUCTION
Part Details
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Part Models
2
1ku List Price
Features
- Serial data input
- 155.52 Mbps/622.08 Mbps/1244.16 Mbps/1250.00 Mbps
- 12-bit acquisition time
- 4-bit parallel LVDS output interface
- Patented dual-loop clock recovery architecture
- Integrated PRBS generator
- Byte rate reference clock
- Loss-of-lock indicator
- Supports double data rate (DDR)-compatible FPGA
- I2C interface to access optional features
- Single-supply operation: 3.3 V
- Power
- 670 mW typical in serial output mode
- 825 mW typical in deserializer mode
- 5 mm × 5 mm, 32-lead LFCSP
Additional Details
The ADN2855 is a burst mode clock and data recovery IC designed for GPON/BPON/GEPON optical line terminal (OLT) receiver applications. The part can operate at 155.52 Mbps, 622.08 Mbps, 1244.16 Mbps, or 1250.00 Mbps data rates, selectable via the I2C interface.
The ADN2855 frequency locks to the OLT reference clock and aligns to the input data within 12 bits of the start of the preamble. The device provides a full rate or an optional half rate output clock for a double data rate (DDR) interface to an FPGA or digital ASIC.
All specifications are quoted for −40°C to +85°C ambient temperature, unless otherwise noted. The ADN2855 is available in a compact 5 mm × 5 mm, 32-lead chip scale package.
Applications
- Passive optical networks
- GPON/BPON/GEPON OLT receivers
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Other places you can find help
Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
Part Models
2
1ku List Price
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ADN2855
Documentation
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Data Sheet
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UPDATED 03/03/2022
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Documentation
Documentation
Technical Documents
2
Data Sheet 1
Frequently Asked Question 1
Design Resources 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADN2855ACPZ | 32-Lead LFCSP (5mm x 5mm w/ EP) |
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ADN2855ACPZ-R7 | 32-Lead LFCSP (5mm x 5mm w/ EP) |
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- ADN2855ACPZ
- Pin/Package Drawing
- 32-Lead LFCSP (5mm x 5mm w/ EP)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- ADN2855ACPZ-R7
- Pin/Package Drawing
- 32-Lead LFCSP (5mm x 5mm w/ EP)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
PCN/PDN Information
Filter by Model
Part Models
Product Lifecycle
PCN
Oct 21, 2016
- 16_0229
Assembly Transfer of Select LFCSP Products to ASE Korea
ADN2855ACPZ
PRODUCTION
ADN2855ACPZ-R7
PRODUCTION
May 11, 2014
- 13_0231
Assembly Transfer of Select 4x4 and 5x5mm LFCSP Products to STATS ChipPAC China.
ADN2855ACPZ
PRODUCTION
ADN2855ACPZ-R7
PRODUCTION
Jul 16, 2012
- 11_0020
Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia.
ADN2855ACPZ
PRODUCTION
ADN2855ACPZ-R7
PRODUCTION
Feb 15, 2010
- 07_0061
LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
ADN2855ACPZ
PRODUCTION
ADN2855ACPZ-R7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Oct 21, 2016
- 16_0229
Assembly Transfer of Select LFCSP Products to ASE Korea
ADN2855ACPZ
PRODUCTION
ADN2855ACPZ-R7
PRODUCTION
May 11, 2014
- 13_0231
Assembly Transfer of Select 4x4 and 5x5mm LFCSP Products to STATS ChipPAC China.
ADN2855ACPZ
PRODUCTION
ADN2855ACPZ-R7
PRODUCTION
Jul 16, 2012
- 11_0020
Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia.
ADN2855ACPZ
PRODUCTION
ADN2855ACPZ-R7
PRODUCTION
Feb 15, 2010
- 07_0061
LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
ADN2855ACPZ
PRODUCTION
ADN2855ACPZ-R7
PRODUCTION
Software & Part Ecosystem
Software & Part Ecosystem
Evaluation Kit
Evaluation Kits 1
EVAL-ADN2855
ADN2855 Evaluation Board
Product Detail
This page contains ordering information for evaluating the ADN2855.
Evaluation Kits1
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