ADN2847
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ADN2847

3.3 V Dual-Loop 50 Mbps to 3.3 Gbps Laser Diode Driver

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Part Details
Part Models 1
1ku List Price
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Features
  • 50 Mbps to 3.3 Gbps operation
  • Single 3.3 V operation
  • Typical rise/fall time: 80 ps
  • Bias current range: 2 mA to 100 mA
  • Modulation current range: 5 mA to 80 mA
  • Monitor photodiode current: 50 µA to 1200 µA
  • Dual MPD functionality for DWDM
  • 50 mA supply current at 3.3 V
  • Closed-loop control of power and extinction ratio
  • Full current parameter monitoring
  • Laser fail and laser degrade alarms
  • Automatic laser shutdown (ALS)
Additional Details
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The ADN2847 uses a unique control algorithm to control both average power and extinction ratio of the laser diode (LD) after initial factory setup. External component count and PCB area are low, as both power and extinction ratio control are fully integrated. Programmable alarms are provided for laser fail (end of life) and laser degrade (impending fail).

Optional dual MPD current monitoring is designed into the ADN2847 specifically for DWDM wavelength control.

The ADN2847 is specified for the −40°C to +85°C temperature range and is available in a 48-lead LFCSP package and a 32-lead LFCSP package.

APPLICATIONS

  • SONET OC-1/3/12/48
  • SDH STM-0/1/4/16
  • Fibre Channel
  • Gigabit Ethernet
  • DWDM dual MPD wavelength control
Part Models 1
1ku List Price
price unavailable

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADN2847ACPZ-32-RL
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Product Lifecycle

PCN

Dec 10, 2014

- 14_0049

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Mar 23, 2012

- 11_0104

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

Jan 29, 2014

- 14_0014

ADI Corporate Obsolescence Notice-January 2014 (Standard Products)

Filter by Model

reset

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Part Models

Product Lifecycle

PCN

Dec 10, 2014

- 14_0049

arrow down

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Mar 23, 2012

- 11_0104

arrow down

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

Jan 29, 2014

- 14_0014

arrow down

ADI Corporate Obsolescence Notice-January 2014 (Standard Products)

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