ADN2841
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ADN2841

Dual-Loop, 50 Mbps to 2.7 Gbps Laser Diode Driver

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warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 4
1ku List Price
price unavailable
Features
  • 50 Mbps to 2.7 Gbps operation
  • Typical rise/fall time: 80 ps
  • Bias current range: 2 mA to 100 mA
  • Modulation current range: 5 mA to 80 mA
  • Monitor photodiode current: 50 μA to 1200 μA
  • Closed-loop control of power and extinction ratio
  • Laser fail and laser degrade alarms
  • Automatic laser shutdown (ALS)
  • Dual MPD functionality for DWDM
  • Optional clocked data
  • Full current parameter monitoring
  • 5 V operation
  • 48-lead LFCSP
  • 32-lead LFCSP (reduced functionality)
Additional Details
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The ADN2841 uses a unique control algorithm to control both the average power and extinction ratio of the laser diode (LD) after initial factory setup. Because power and extinction ratio control are fully integrated, external component count is low and PCB area is small. Programmable alarms are provided for laser fail (end of life) and laser degrade (impending fail).

The ADN2841 has circuitry for a second monitor photodiode, which enables DWDM wavelength control.

Applications

  • DWDM dual MPD wavelength fixing
  • SONET OC-1/3/12/48
  • SDH STM-1/4/16
  • Fibre Channel
  • Gigabit Ethernet
Part Models 4
1ku List Price
price unavailable

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADN2841ACPZ-32
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ADN2841ACPZ-32-RL7
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  • HTML
ADN2841ACPZ-48
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  • HTML
ADN2841ACPZ-48-RL
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  • HTML

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Part Models

Product Lifecycle

PCN

Dec 10, 2014

- 14_0049

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Mar 23, 2012

- 11_0104

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

Oct 28, 2009

- 08_0008

Qualification of 8" 0.6um BiCMOS wafer fab process at Analog Devices, Limerick, Ireland.

ADN2841ACPZ-32

ADN2841ACPZ-32-RL7

ADN2841ACPZ-48

ADN2841ACPZ-48-RL

Apr 29, 2015

- 14_0049

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Dec 10, 2014

- 14_0049

arrow down

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Mar 23, 2012

- 11_0104

arrow down

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

Oct 28, 2009

- 08_0008

arrow down

Qualification of 8" 0.6um BiCMOS wafer fab process at Analog Devices, Limerick, Ireland.

ADN2841ACPZ-32

ADN2841ACPZ-32-RL7

ADN2841ACPZ-48

ADN2841ACPZ-48-RL

Apr 29, 2015

- 14_0049

arrow down

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Software and Part Ecosystem

Software and Part Ecosystem

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