ADN2526
NOT RECOMMENDED FOR NEW DESIGNS11.3 Gbps Active Back-Termination, Differential Laser Diode Driver
- Part Models
- 3
- 1ku List Price
- price unavailable
Part Details
- 3.3 V operation
- Up to 11.3 Gbps operation
- Typical 24 ps rise/fall times
- Full back-termination of output transmission lines
- Drives TOSAs with resistances ranging from 5 Ω to 50 Ω
- Bias current range: 10 mA to 100 mA
- Differential modulation current range: 10 mA to 80 mA
- Voltage input control for bias and modulation currents
- Data inputs sensitivity: 150 mV p-p diff
- Automatic laser shutdown (ALS)
- Cross point adjustment (CPA)
- XFP-compliant bias current monitor
- SFP+ MSA compliant
- Optical evaluation board available
- Compact 3 mm × 3 mm LFCSP
The ADN2526 laser diode driver is designed for direct modulation of packaged laser diodes that have a differential resistance ranging from 5 Ω to 50 Ω. The active back-termination in the ADN2526 absorbs signal reflections from the TOSA end of the output transmission lines, enabling excellent optical eye quality to be achieved even when the TOSA end of the output transmission lines is significantly misterminated. ADN2526 is an SFP+ MSA-compliant device, and its small package and enhanced ESD protection provide the optimum solution for compact modules where laser diodes are packaged in low pin-count optical subassemblies.
The modulation and bias currents are programmable via the MSET and BSET control pins. By driving these pins with control voltages, the user has the flexibility to implement various average optical power and extinction ratio control schemes, including closed-loop or look-up table control. The automatic laser shutdown (ALS) feature allows the user to turn on/off the bias and modulation currents by driving the ALS pin with a LVTTL logic source.
The product is available in a space-saving 3 mm × 3 mm LFCSP specified from −40°C to +85°C.
Applications
- SONET OC-192 and SDH STM-64 optical transceivers
- 10 Gb Fibre Channel transceivers
- 10 Gb Ethernet optical transceivers
- SFP+/XFP/X2/XENPAK/XPAK/MSA 300 optical modules
Documentation
Data Sheet 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADN2526ACPZ | 16-Lead LFCSP (3mm x 3mm w/ EP) | ||
| ADN2526ACPZ-R2 | 16-Lead LFCSP (3mm x 3mm w/ EP) | ||
| ADN2526ACPZ-R7 | 16-Lead LFCSP (3mm x 3mm w/ EP) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Oct 21, 2016 - 16_0229 Assembly Transfer of Select LFCSP Products to ASE Korea |
||
| ADN2526ACPZ | ||
| ADN2526ACPZ-R2 | ||
| ADN2526ACPZ-R7 | ||
|
Apr 28, 2014 - 13_0224 Assembly Transfer of Select 2x3 and 3x3mm LFCSP Products to STATS ChipPAC China. |
||
| ADN2526ACPZ | ||
| ADN2526ACPZ-R2 | ||
| ADN2526ACPZ-R7 | ||
|
Sep 10, 2012 - 11_0020 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia. |
||
| ADN2526ACPZ | ||
| ADN2526ACPZ-R7 | ||
This is the most up-to-date revision of the Data Sheet.
Software Resources
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Request a Driver/SoftwareEvaluation Kits
ADN2526 Evaluation Board