ADG3245
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ADG3245

2.5 V/3.3 V, 8 Bit, 2 Port Level Translator, Bus Switch

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IBIS Model ADG3245 LFCSP IBIS Model Download 72.52 K IBIS Model ADG3245 TSSOP IBIS Model Download 72.51 K IBIS Model ADG3245 LFCSP IBIS Model Download 72.52 K IBIS Model ADG3245 TSSOP IBIS Model Download 72.51 K
Part Models 3
1ku List Price Starting From $1.19
Features
  • 225 ps propagation delay through the switch
  • 4.5 Ω switch connection between ports
  • Data rate 1.244 Gbps
  • 2.5 V/3.3 V supply operation
  • Selectable level shifting/translation
  • 20-lead TSSOP and LFCSP packages
  • Level translation
    3.3 V to 2.5 V
    3.3 V to 1.8 V
    2.5 V to 1.8 V
  • Small signal bandwidth 610 MHz
Additional Details
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The ADG3245 is a 2.5 V or 3.3 V, 8-bit, 2-port digital switch. It is designed on Analog Devices’ low voltage CMOS process, which provides low power dissipation yet gives high switching speed and very low on resistance, allowing inputs to be connected to outputs without additional propagation delay or generating additional ground bounce noise.

The switches are enabled by means of the bus enable (BE) input signal. These digital switches allow bidirectional signals to be switched when ON. In the OFF condition, signal levels up to the supplies are blocked.

This device is ideal for applications requiring level translation. When operated from a 3.3 V supply, level translation from 3.3 V inputs to 2.5 V outputs is allowed. Similarly, if the device is operated from a 2.5 V supply and 2.5 V inputs are applied, the device will translate the outputs to 1.8 V. In addition to this, a level translating select pin (SEL) is included. When SEL is low, VCC is reduced internally, allowing for level translation between 3.3 V inputs and 1.8 V outputs. This makes the device suited to applications requiring level translation between different supplies, such as converter to DSP/microcontroller interfacing.

APPLICATIONS

  • 3.3 V to 1.8 V voltage translation
  • 3.3 V to 2.5 V voltage translation
  • 2.5 V to 1.8 V voltage translation
  • Bus switching
  • Bus isolation
  • Hot swap
  • Hot plug
  • Analog switch applications

PRODUCT HIGHLIGHTS

  1. 3.3 V or 2.5 V supply operation
  2. Extremely low propagation delay through switch
  3. 4.5 Ω switches connect inputs to outputs
  4. Level/voltage translation
  5. 20-lead TSSOP and LFCSP (4 mm × 4 mm) packages
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file View Data Sheet (Rev.C)
Documentation View All Documentation
IBIS Model ADG3245 LFCSP IBIS Model Download 72.52 K IBIS Model ADG3245 TSSOP IBIS Model Download 72.51 K IBIS Model ADG3245 LFCSP IBIS Model Download 72.52 K IBIS Model ADG3245 TSSOP IBIS Model Download 72.51 K
Part Models 3
1ku List Price Starting From $1.19
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ADG3245

Documentation

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Data Sheet

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UPDATED 09/28/2006
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ADG3245: 2.5 V/3.3 V, 8 Bit, 2 Port Level Translating, Bus Switch Data Sheet (Rev.C)

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Technical Articles

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UPDATED 04/15/2004
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Data-acquisition system uses fault protection redirect icon

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UPDATED 05/04/2004
Chinese
Data-acquisition system uses fault protection redirect icon

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UPDATED 08/01/2003
English
Enhanced Multiplexing for MEMS Optical Cross Connects redirect icon

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UPDATED 11/14/2003
Chinese
Enhanced Multiplexing for MEMS Optical Cross Connects redirect icon

User Guide

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UPDATED 08/24/2016
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UG-1036: Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio (Rev.0) redirect icon

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Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG3245BCPZ 20-Lead LFCSP (4mm x 4mm w/ EP) external-link
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  • Material Declaration external-link
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  • Reliablity Data external-link
ADG3245BRUZ 20-Lead TSSOP external-link
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  • Material Declaration external-link
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  • Reliablity Data external-link
ADG3245BRUZ-REEL7 20-Lead TSSOP external-link
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  • Material Declaration external-link
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  • Reliablity Data external-link

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Mar 23, 2012

- 11_0104

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

ADG3245BCPZ

PRODUCTION

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PCN11_0104_Form

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Material_Report

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Qualification Report Summary

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Detailed Change Description

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Detailed Change Description

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Package Outline Drawing

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Apr 5, 2021

- 21_0035

Amkor Philippines as an Alternate Site for TSSOP_4.4

ADG3245BRUZ

PRODUCTION

ADG3245BRUZ-REEL7

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PCN21_0035_Form

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Material_Report

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Qualification Results Summary

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Other

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Jan 20, 2012

- 11_0218

Halogen Free Material Change for Certain TSSOP Products at Carsem

ADG3245BRUZ

PRODUCTION

ADG3245BRUZ-REEL7

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PCN11_0218_Form

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Material_Report

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Qualification Report Summary

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Product Lifecycle

PCN

Mar 23, 2012

- 11_0104

arrow down

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

ADG3245BCPZ

PRODUCTION

pdf

PCN11_0104_Form

external-icon

xls

Material_Report

Download

pdf

Qualification Report Summary

external-icon

pdf

Detailed Change Description

external-icon

pdf

Detailed Change Description

external-icon

pdf

Package Outline Drawing

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Apr 5, 2021

- 21_0035

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Amkor Philippines as an Alternate Site for TSSOP_4.4

ADG3245BRUZ

PRODUCTION

ADG3245BRUZ-REEL7

PRODUCTION

pdf

PCN21_0035_Form

external-icon

xls

Material_Report

Download

pdf

Qualification Results Summary

external-icon

pdf

Other

external-icon
Jan 20, 2012

- 11_0218

arrow down

Halogen Free Material Change for Certain TSSOP Products at Carsem

ADG3245BRUZ

PRODUCTION

ADG3245BRUZ-REEL7

PRODUCTION

pdf

PCN11_0218_Form

external-icon

xls

Material_Report

Download

pdf

Qualification Report Summary

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Software & Part Ecosystem

Evaluation Kits 1

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EVAL-24TSSOP

Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio

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EVAL-24TSSOP

Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio

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EVAL-24TSSOP
Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio

Features and Benefits

  • 24-lead TSSOP evaluation board 
  • Clamp allows the main device to be easily changed 
  • Gold pin connectors allow the addition of passive components 
  • SMB connectors for the input/output of signals 
  • Additional space on-board to allow for prototyping 

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Product Detail

The EVAL-24TSSOPEBZ evaluation board evaluates 24-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-24TSSOPEBZ to secure a 24-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.


A 24-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K24 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.


Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.

Resources

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PDF

UG-1036: Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio (Rev.0) Download

318.06 K

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Evaluation Kits1

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EVAL-24TSSOP

Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio

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