ADATE209

PRODUCTION

4.0 Gbps Dual Driver

Data Sheet (Rev. B) Product Selection Table

Part Models: 1
1ku List Price: Starting From $41.66

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Overview

>4.0 Gbps (2 V swings)
120 ps rise time/fall time (2 V swings)
<1.0 W for dual driver (<500 mW/channel)

−1 V to +3.5 V range
Fast termination mode (VTx)
Cable loss compensation

The ADATE209 is a dual pin driver designed for testing DDR2, DDR3, and DDR4. It can also be used for high speed SoC applications, such as testing PCI Express 1.0 and HDMI^™. The device is a three-level driver capable of high fidelity swings from 200 mV to 4 V over a −1 V to +3.5 V range. It has rise/fall times (20% to 80%) under 120 ps for a 2 V programmed swing and 150 ps for a 3 V programmed swing, and is capable of supporting data rates of 4.4 Gbps and 3.2 Gbps, respectively.

The device is capable of high speed transitions into and out of termination mode. It also contains peaking/pre-emphasis circuitry.

The ADATE209 is available in an 8 mm × 8 mm, 49-ball CSP_BGA.

APPLICATIONS

Automatic test equipment
Semiconductor test systems
Board test systems
Instrumentation and characterization equipment
High speed memory testing (DDR2/DDR3/DDR4)
HDMI testing

Part Models: 1
1ku List Price: Starting From $41.66

Documentation

Data Sheet 1

ADATE209: 4.0 Gbps Dual Driver Data Sheet (Rev.B) 02/10/2010

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADATE209BBCZ	49-Ball CSPBGA (8mm x 8mm x 1.465mm)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Mar 9, 2015 - 14_0249 Assembly Transfer of Select CSP_BGA Products to STATS ChipPAC Korea Plant 3
		PCN14_0249_Form Material_Report Detailed Change Description Qualification Results Summary
ADATE209BBCZ	PRODUCTION
May 9, 2014 - 10_0270 CANCELLED: Transfer to JCAP and Wafer Bumping Material Changes for ADATE209
		PCN10_0270_Form Material_Report Qualification Plan Summary
ADATE209BBCZ	PRODUCTION
May 7, 2014 - 14_0116 ADATE209 Bumping Site Transfer and Wafer Bumping Material Changes
		PCN14_0116_Form Material_Report Qualification Plan Summary
ADATE209BBCZ	PRODUCTION