HMC7150

RECOMMENDED FOR NEW DESIGNS

28 Gbps EML Driver

Part Models: 2
1ku List Price: price unavailable

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Overview

Operation up to 28.3 Gbps
Low DC Power Dissipation, 0.12W for 1.5V_P-P swing @ 3.3V supply 0.50W for 2.3Vpp swing @ 6V supply

Adjustable Output Amplitude from 1.2V_P-P to 2.3V_P-P
16 Lead 3x3mm SMT Package: <9 mm²

The HMC7150 is a broadband driver amplifier for electro-absorption modulated lasers (EML) and supports data-rates up to 28.3Gbps to meet the 100Gb Ethernet system requirements. The part provides the module designers scalable power dissipation for varying drive voltage characteristics of different modulators and the power consumption of the module can be set as low as 0.12W to 0.5W at 1.5V_P-P and 2.3V_P-P outputs amplitudes, respectively. The HMC7150 supports wide range of supply voltages from 3.3V to 6V and delivering excellent time domain performance. The output amplitude and cross-point can be adjusted via control pins. The input and output are 50 Ohms matched and used AC coupled. The HMC7150 is in compact leadless 3x3mm surface mountable package.

APPLICATIONS

100Gb Ethernet ER4/ LR4 systems
CFP/CFP2/CFP4 or similar form factor modules
Optical transceivers and pluggable modules
Broadband gain stages and pre-amplifiers
Broadband Test & Measurement Equipment

Part Models: 2
1ku List Price: price unavailable

Documentation

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Complete documentation is available upon completion of a Non-Disclosure Agreement (NDA).

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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC7150LP3DE	LFCSP:LEADFRM CHIP SCALE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC7150LP3DETR	LFCSP:LEADFRM CHIP SCALE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Mar 29, 2023 - 22_0048 Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products
		PCN22_0048_Form Material_Report Qualification Results Summary Detailed Change Description
HMC7150LP3DE	PRODUCTION
HMC7150LP3DETR	PRODUCTION