MAX32007

RECOMMENDED FOR NEW DESIGNS

Octal 3.0Gbps DCL with Integrated Level Setting DACs, Cable Droop Compensation, and PMU switches

Industry's Fastest Octal-Channel Pin Electronics Driver

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Overview

  • Low Power at High-Speed Maximizes Driver Performance
    • Typical 0.89W Per Channel Power Dissipation
    • 10nA Low-Leak Mode
    • High-Speed Data Rate (50Ω)
      • 3.0Gbps Typical at 0.1Vpp
      • 2.5Gbps Typical at 0.5Vpp
      • 2.4Gbps Typical at 0.75Vpp
      • 1.3Gbps Typical at 1.5Vpp
    • Voltage Range from -1.5V to +4.5V
    • Integrated VHH Programming Mode (4th-Level Drive) up to 7.1V
  • Integrated Functionality Provides Value-Add Features
    • Integrated ±12mA Passive Load
    • Programmable Double Time Constant Cable Droop Compensation–Drive and Receive Paths
    • Digital Slew-Rate Control for EMI-Sensitive Applications
    • 64 Independent 14-bit Level-Setting DACs
    • 50MHz SPI Interface

The MAX32007 is a fully integrated, high performance, high speed 3Gbps octal-channel pin electronics driver that integrates multiple automatic test equipment (ATE) functions into a single IC. This DCL (driver/comparator/load) device is compatible with most high-speed logic families and includes a 4-level driver, dynamic clamps, window comparator, passive load, differential comparator, slew rate control, driver and comparator cable droop compensation, voltage clamps, PMU switches, and level-setting DACs.

The MAX32007 driver features a -1.5V to +4.5V input range, high-impedance mode, active-termination (3rd-level drive), and VHH programming (4th-level drive) up to 7.1V. The window comparators provide low timing variation over changes in slew rate, pulse width, or overdrive voltage. The MAX32007 features dynamic clamps that limit high-speed device-under-test (DUT) waveforms as well as cable droop compensation for optimization of driver and return path signals. The integrated passive load is rated for ±12mA. Configuration of the many features are done through a 50MHz SPI interface.

The MAX32007 is available in a 16mm x 10mm x 1.4mm csBGA package with exposed pad on the top for easy heat removal. The ball pitch is 0.8mm with a ball grid array of 19x12. Typical power dissipation is rated for 0.89W per channel. The MAX32007 operates over an internal die temperature range of +40°C to +100°C with a nominal operating point of +70°C. The device provides both a temperature monitor output (TSA) and an over-temp indicator (TSD).

Applications

  • SoC ATE
  • Memory ATE
  • Digital Testers
  • Burn-In Testers
  • Wafer Testers

MAX32007
Octal 3.0Gbps DCL with Integrated Level Setting DACs, Cable Droop Compensation, and PMU switches
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Documentation

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Complete documentation is available upon completion of a Non-Disclosure Agreement (NDA).

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Tools & Simulations


Evaluation Kits

MAX32007EVKIT

Evaluation Kit for the MAX32007

Features and Benefits

  • Easy Evaluation of MAX32007—Octal Channel DCL, Level Setting DACs, and PMU Switches
  • On-board MAX32625 Pico-board
  • Includes Heatsink and Fan
  • 50Ω SMB Connectors for Drivers and Comparators
  • 50Ω BNC Connectors for PMU Switches
  • On-board Voltage Regulators
  • Micro-USB Interface
  • Headers for External SPI Interface
  • Proven PCB Layout
  • Windows®10-Compatible EV kit software GUI
  • Fully assembled and tested

Product Details

The MAX32007 evaluation kit (EV kit) is a fully assembled and tested printed circuit board (PCB) that simplifies evaluation and demonstrates the functionality of the MAX32007, a high-speed octal channel driver, comparator, and passive load pin electronics IC. Standard 50Ω SMB connectors are included on the EV kit for the inputs and outputs to allow for quick and easy evaluation on the test bench.

The EV kit contains a microcontroller (MCU) that translates between the SPI interface and USB to allow the user to configure internal registers and modes with Graphical User Interface (GUI) software running on a PC. The EV kit includes Windows®10-compatible software that provides a simple GUI for the configuration of all the MAX32007 registers through SPI. The EV kit is fully assembled and tested at the factory.

This document provides a component list, a list of equipment required to evaluate the device, a straight-forward test procedure to verify functionality, a description of the EV kit circuit, the circuit schematic, and artwork for each layer of the printed circuit board (PCB).

Applications

  • Burn-In Testers
  • Digital Testers
  • Memory ATE
  • SoC ATE
  • Wafer Testers

MAX32007EVKIT
Evaluation Kit for the MAX32007

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