The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system. It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.
The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules (up to 16 per rack). 8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment.
Input and output modules are offered in both isolated (±1500 V peak) and nonisolated versions. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs. Each input module provides two simultaneous outputs: 0 V to +10 V (or ±10 V) and 4–20 mA (or 0–20 mA). Output modules accept 0 V to +10 V (or ±10 V) single ended signals and provide an isolated or nonisolated 4–20 mA (or 0–20 mA) process signal. All modules feature a universal pinout and may be readily “mixed and matched” and interchanged without disrupting field wiring.
Each backplane contains the provision for a subsystem power supply. The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power. Two LEDs are used to indicate that power is being applied.
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|3B45/3B46: Isolated Frequency Input Data Sheet (Rev 0, 01/1999) (pdf, 358 kB)||Data Sheets|
|AN-535: Digital Input/Output Subsystems (pdf, 336 kB)||Application Notes|
3B User's Manual
(pdf, 4732 kB)
The 3B Series Signal Conditioning I/O Subsystem
Make vs. Buy! When Should I Reinvent the Wheel?
(Analog Dialogue, Vol. 33, No. 10, November-December, 1999)
|3B Series Backplanes||Backplanes||HTML|
IOS Custom Product Worksheet
As a Design Subcontractor, IOS believes it essential to engage with our customers early in the development cycle. Complete the form and it will be reviewed and you will be contacted by one of our design specialists.
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|3B Series Custom Configuration Ranges||Configuration Guides||HTML|
|3B Series Configuration Guide||Configuration Guides||HTML|
|3B Series Power Supplies||Power Supplies||HTML|
3B Series Overviews
|IOS Short From Brochure (pdf, 2298 kB)||Overview|
|Selecting the Right Signal Conditioning Series for Your Application||Overview||HTML|
|All Series Modules||Overview||HTML|
|3B Series Model Definitions||Overview||HTML|
|IOS 3 Year Warranty (pdf, 23 kB)||Overview|
|RAQs index||Rarely Asked Questions||HTML|
|Glossary of EE Terms||Glossary||HTML|
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3B Series I/O Subsystem Software Tools
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Symbols and Footprints— Analog Devices offers Symbols & Footprints which are compatible with a large set of today’s CAD systems for broader and easier support.
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The USA list pricing shown is for BUDGETARY USE ONLY, shown in United States dollars (FOB USA per unit for the stated volume), and is subject to change. International prices may differ due to local duties, taxes, fees and exchange rates. For volume-specific price or delivery quotes, please contact your local Analog Devices, Inc. sales office or authorized distributor. Pricing displayed for Evaluation Boards and Kits is based on 1-piece pricing.