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3B39:  Isolated Current Output Signal Conditioning Module

Product Details

The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system. It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.

The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules (up to 16 per rack). 8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment.

Input and output modules are offered in both isolated (±1500 V peak) and nonisolated versions. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs. Each input module provides two simultaneous outputs: 0 V to +10 V (or ±10 V) and 4–20 mA (or 0–20 mA). Output modules accept 0 V to +10 V (or ±10 V) single ended signals and provide an isolated or nonisolated 4–20 mA (or 0–20 mA) process signal. All modules feature a universal pinout and may be readily “mixed and matched” and interchanged without disrupting field wiring.

Each backplane contains the provision for a subsystem power supply. The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power. Two LEDs are used to indicate that power is being applied.


  • Process Current Output (0-20mA or 4-20mA)
  • +10V or ± 10V Input
  • Drives up to 850Ω Loop Resistance

Functional Block Diagram for 3B39

Additional 3B Resources: Accessories, Backplanes and Power Supplies
Sales and Service: North America (SCS Embedded Tech), Rest of World
Download a PDF copy of this user manual


Title Content Type File Type
3B39: Isolated Process Current Output Data Sheet  (Rev 0, 01/1999) (pdf, 381 kB) Data Sheets PDF
AN-535: Digital Input/Output Subsystems  (pdf, 336 kB) Application Notes PDF
3B User's Manual  (pdf, 4732 kB)
The 3B Series Signal Conditioning I/O Subsystem
User Guides PDF
Make vs. Buy! When Should I Reinvent the Wheel?
(Analog Dialogue, Vol. 33, No. 10, November-December, 1999)
Analog Dialogue HTML
3B Series Backplanes Backplanes HTML
IOS Custom Product Worksheet
As a Design Subcontractor, IOS believes it essential to engage with our customers early in the development cycle. Complete the form and it will be reviewed and you will be contacted by one of our design specialists.
Custom Product Worksheet HTML
3B Series Configuration Guide Configuration Guides HTML
3B Series Power Supplies Power Supplies HTML
Selecting the Right Signal Conditioning Series for Your Application Overview HTML
All Series Modules Overview HTML
IOS 3 Year Warranty  (pdf, 23 kB) Overview PDF
3B Series Overviews Overview HTML
IOS Short Form Brochure  (pdf, 2298 kB) Overview PDF
RAQs index Rarely Asked Questions HTML
Glossary of EE Terms Glossary HTML

Evaluation Kits & Symbols & Footprints

Symbols and Footprints— Analog Devices offers Symbols & Footprints which are compatible with a large set of today’s CAD systems for broader and easier support.

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Price, packaging, availability

3B39 Model Options
Price Table Help

The USA list pricing shown is for BUDGETARY USE ONLY, shown in United States dollars (FOB USA per unit for the stated volume), and is subject to change. International prices may differ due to local duties, taxes, fees and exchange rates. For volume-specific price or delivery quotes, please contact your local Analog Devices, Inc. sales office or authorized distributor. Pricing displayed for Evaluation Boards and Kits is based on 1-piece pricing.

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