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| ADI Overall Life-Test Data Summary | |
| Overall Sample Size | 445576 |
| Qty. Fail | 0 |
| Equivalent Device Hrs. @ 55 deg C | 72503111445 |
| FIT Rate (60% CL, 55 deg C) | 0.01 |
| MTTF (60% CL, 55 deg C) in Hrs | 79126817323 |
| FIT Rate (90% CL, 55 deg C) | 0.03 |
| MTTF (90% CL, 55 deg C) in Hrs | 31487770868 |
| Calculations assumes 0.7 eV Activation Energy | |
Please note: Where a device of interest is not sampled, it is valid to use the reliability data of the particular process technology to which the part belongs, since all parts within the same family are designed to the same rules and manufacturing as controlled by SPC.
The data provided in this calculation is generic data that reflects the overall reliability of the Wafer Fabrication Technology grouping for the selected product. The data may have been collected on the product selected or other Analog Devices products manufactured using the same technology grouping.
The data is intended to provide a high-level assessment of the reliability of the fabrication process used to manufacture a given product or products. Analog Devices products should never be operated outside the specified datasheet limits and this data should never be used as an indication of the Reliability of a product outside of those specified data sheet limits.
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