EVAL-ADPA9005

製品概要

The ADPA9005-EVALZ consist of a 4-layer printed circuit board (PCB) fabricated from 8mil thick Rogers 4003C copper clad, forming a nominal thickness of 64 mils, mounted to an aluminum heat spreader. The evaluation board incorporates a copper coin beneath the exposed paddle of the ADPA9005, in addition to the heat spreader, providing enhanced thermal dissipation and mechanical support for the PCB. The mounting holes on the heat spreader allow attachment to larger heatsinks to improve thermal management. The RFIN and RFOUT ports are populated by 2.92mm female coaxial connectors, and their respective RF traces are of 50Ω characteristic impedance. The ADPA9005-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA9005.

The RF transmission lines are 50Ω grounded coplanar waveguides. The package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat spreader.

The power supply decoupling capacitors shown in Figure 5 in the data sheet represent the configuration used to characterize the device.

For full details on the ADPA9005, see the ADPA9005 data sheet, which must be consulted in conjunction with this user guide when using the ADPA9005-EVALZ evaluation board.