Designed, Built, Tested
Board pictured here has been fully assembled and tested.

Overview

Design Resources

Design & Integration File

  • Performance Measurements at 25°C and 100°C
  • PCS Mixer Measurement Test Setup
  • Schematic of MAX2323 Evaluation Kit
  • Bill of Materials Pt 1
  • Bill of Materials Pt 2
  • Bill of Materials Pt 3
Download Design Files 144.8 K

Description

Objective: To determine the nondestructive operating temperature range of this dual-band triple-mode front-end IC.

This project entailed custom-testing the MAX2323 at an extended temperature range up to +110°C for an automotive guidance system application. The main test objective was to determine that the circuit performance routinely recovered with no noticeable performance degradation at room temperature, especially from high heat. Note that initially it was found that some soft plastic components (jumpers) on the board melted, but this was remedied by applying a local controlled-heat source.

The MAX2323 low-noise amplifier (LNA) plus mixer is designed for dual-band CDMA cellular phone handsets, but it can also be used in dual-band TDMA, GSM, EDGE, or WCDMA applications. It differs from its predecessor (the MAX2320) by adding a third "mid-gain" state for the cellular-band LNA, which improves switchover hysteresis margin. It also comes in a smaller package (28-QFN) and offers increased third-order input intercept.

Parts Used

Documentation & Resources

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  • Design & Integration File (1)
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