Overview
Features and Benefits
- 3D depth camera evaluation kit
- ADTF3175 megapixel fully-calibrated ToF module with 75° × 75° field of view
- Operating range up to 4m at 19% target reflectance and 3klux equivalent sunlight
- ADSD3500 depth ISP for full resolution depth compute at 30 FPS
- 22-pin MIPI CSI-2 camera connector
- Holoscan Sensor Bridge Ready – Seamlessly connects ADCAM Time-of-Flight (ToF) sensors to NVIDIA® Holoscan through Hololink/Sensor Bridge for GPU-native acquisition, visualization, and AI processing
Product Details
The ADCAM3175-2M-EBZ is a 3D depth sensing camera evaluation kit. It features the ADTF3175, a complete megapixel Time-of- Flight (ToF) module for high resolution, high accuracy 3D depth sensing and vision systems. It also includes Analog Devices, Inc. depth image signal processor (ISP), the ADSD3500, in a dual processor configuration to support full resolution depth frame processing at 30 frames per second (FPS). The kit is powered using a single USB-C connector with local power management included for the ADTF3175 and ADSD3500 components. Processed depth and active brightness frames are output through a standard 22-pin mobile industry processor interface (MIPI) Camera Serial Interface 2 (CSI-2) camera connector for seamless interface with the NVIDIA Jetson Orin Nano™ developer kit or Raspberry Pi 5 kit.
Documentation & Resources
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EVAL-ADCAM3175 User Guide: ADCAM3175-2M-EBZ User Guide (Rev. 0)9/18/2026PDF1 MB