High Fidelity PCB Design for Multichannel Beamformers

This is Part 1 of a two-part article series. Part 1 discusses designing PCBs with highly accurate 50 Ω transmission lines and minimizing impedance discontinuities at connector transitions to reduce return loss. Part 2 will discuss isolation between transmission lines, how isolation affects beamformer IC performance, and how to choose the correct line topology for a given isolation requirement.

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