ADI Logo

Reliable PCB Assembly of Land Grid Array Packages in Planar Phased Array Antennas

This article will explore some of the challenges associated with pcb footprint design of Land Grid Array (LGA) packages that are widely used in phased array systems, and will offer guidance and recommendations for best pcb assembly results.

Reliable PCB Assembly of Land Grid Array Packages in Planar Phased Array Antennas Cover
Communication consent
© 1995 - 2024 Analog Devices, Inc. All Rights Reserved

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY23 and approximately 26,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible.