With an ultrathin profile below 2mm, µModule Regulator allows designer to take advantage of mostly empty area on backside of PCB for power circuits, freeing space on top side for components such as connectors, transceivers, and memory. Height-restricted applications such as optical data transport systems, PCIe boards and RAID system. Another advantage of an ultrathin μModule package is that it can be placed very close to low profile loads such as such as FPGAs, GPUs, ASICs and processors while sharing a common heatsink or cold plate.

The Component-on-Package (CoP) technology provides faster cooling of µModule regulators from top, four sides and bottom of package. A small PCB footprint, more power, and better thermal performance—all three are simultaneously possible with CoP technology, a new method in construction of POL regulators.

LTM4700 is a dual output 50A, single 100A step-down µModule regulator with PMBus I²C digital interface. The current mode architecture enables ±3% of accurate current sharing among the 100A blocks. Precise current sharing produces a power supply that spreads the heat evenly between devices.