Design Center
Packaging, Quality, Symbols & Footprints
Package Index
CSP (Chip Scale Package)
Tape CSP BGA
Print
Enable javascript
Search
Simulation Models
BSDL Models
Thermal Models
IBIS Models
MathWorks Behavioral Models
S-Parameters
SPICE Models
Sys-Parameter Models for Keysight’s Pathwave System Design and RF Synthesis
Reference Designs
Circuits from the Lab
Drivers & Reference Code
FPGA and Processors Compatible Reference Designs
Evaluation Hardware & Software
Product Evaluation Boards and Kits
Evaluation & Development Platforms
JESD204 Interface Framework
Software
Packaging, Quality, Symbols & Footprints
Package Index
Package Resources
Quality & Reliability
Symbols, Footprints & 3D Models
Circuit Design Tools & Calculators
Amplifier & Linear
Clock & Timing
Data Converter
LTspice
Power Management
RF & Synthesis
Processors & DSP
Hardware
Technical Library
Third Party Developers Program
Tape CSP BGA
Tape Chip Scale Package BGA, 0.5, 0.65, 0.8, and 1.0mm pitch
Region
India
Korea
Singapore
Taiwan
Languages
English
简体中文
日本語
Руccкий
×
×
Close
Modal title