All RF traces are routed on Layer 1 (primary side) and the remaining three layers are ground planes that provide a solid ground for RF transmission lines. The top dielectric material is Rogers 4350, which offers low loss performance. The prepreg material in Layer 2 attaches the Isola 370HR core layer with copper traces layers above and below the core layer. Both prepreg material and the Isola 370HR core layer are used to achieve the required board finish thickness.
The circuit board in this application uses RF circuit design techniques. Signal lines must have 50 Ω impedance and the package ground leads and exposed pad must be connected directly to the ground plane. Use a sufficient number of via holes to connect the top and bottom ground planes.
For additional evaluation board information please see the data sheet.