Product DetailsThe circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ω impedance while the package ground leads and backside ground paddle should be connected directly to the ground plane similar to that shown on page 11 of the data sheet. A sufficient number of via holes should be used to connect the top and bottom ground planes.
Documentation & Resources
HMC4069 Design Files11/6/2020
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