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Overview
Product Details
The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ω impedance while the package ground leads and backside ground paddle should be connected directly to the ground plane similar to that shown on page 10 of the data sheet. A sufficient number of via holes should be used to connect the top and bottom ground planes.Markets and Technologies
Applicable Parts
Documentation & Resources
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HMC3716 Design Files3/19/2021ZIP329 K
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HMC3716 Gerber Files8/1/2017ZIP130K