HFAN-08.1: Thermal Considerations of QFN and Other Exposed-Paddle Packages

2002-01-10

Figure 1

   

摘要

This application note will give a brief introduction to thermal theory and general layout considerations that can be applied in order to obtain the benefits of the exposed-paddle packages. A worst-case example of performance degradation due to improper use of the exposed paddle will also be provided using thermal resistance data.

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