日月光与ADI宣布战略合作

日月光与ADI宣布战略合作

  • 日月光计划收购ADI位于马来西亚槟城的工厂,以增强全球供应链韧性并实现制造多元化
  • ADI与日月光将通过共同投资及长期供应协议深化合作

中国,北京 — 2025年10月21日—日月光投资控股股份有限公司(ASE. NYSE: ASX, TAIEX: 3711)与Analog Devices, Inc. (NASDAQ: ADI)宣布在马来西亚槟城达成战略合作并签署具有约束力的备忘录。

日月光将收购Analog Devices Sdn. Bhd. 100%的股权,包含其位于槟城的制造厂区(具体内容以最终签署的交易文件为准)。此外,ADI与日月光将签署一项长期供应协议,由日月光为ADI提供制造服务;双方还将共同投资,提升槟城工厂的技术能力。

ADI槟城工厂成立于1994年,坐落于峇六拜(Bayan Lepas)核心工业区,建筑面积超68万平方英尺。此次收购将显著扩展日月光全球IC封测服务网络,创造更多投资机遇,以应对日益复杂的客户与供应链需求。

日月光投控首席运营官吴田玉表示:“收购ADI槟城工厂将可扩大日月光全球制造能力,实现更高的运营灵活性与规模。此次收购将持续强化双方的合作,为ADI的高性能模拟、混合信号和数字信号处理芯片提供卓越的封装和测试解决方案。我们欢迎ADI槟城团队加入日月光,并期待结合两家公司的优势,推动未来的成长和创新。”

ADI全球运营与技术执行副总裁Vivek Jain表示:“封装技术与制造韧性是驱动ADI短期及长期成长的核心要素。通过携手日月光扩展槟城工厂能力与产能,本次合作将强化技术供应、提升供应链韧性,持续为客户提供卓越支持。同时,双方将整合专业资源,推动槟城厂区制造与技术升级,并为员工创造持续的职业发展机遇。”

双方拟于2025年第四季度签署最终协议,交易预计在2026年上半年完成,以交割条件满足(或豁免)及监管审批通过为前提。交易完成后,日月光将接管槟城工厂的运营并做进一步开发,以服务ADI及其他客户。

关于日月光投控

日月光投资控股股份有限公司(“日月光投控”)是全球半导体封装与测试制造服务领军企业。我们致力于满足半导体产业对于高速、微型化与高性能芯片的需求,持续开发和提供广泛多样的封测解决方案,包括芯片测试程序开发、前端工程测试、晶圆针测、晶圆凸块、基板设计与制造、晶圆级封装、倒装芯片、系统级封装、成品测试以及电子制造服务。如需查询详细信息,请访问 www.aseglobal.com

关于ADI公司

Analog Devices, Inc. (NASDAQ: ADI)是全球领先的半导体公司,致力于在现实世界与数字世界之间架起桥梁,以实现智能边缘领域的突破性创新。ADI提供结合模拟、数字和软件技术的解决方案,推动数字化工厂、汽车和数字医疗等领域的持续发展,应对气候变化挑战,并建立人与世界万物的可靠互联。ADI公司2024财年收入超过90亿美元,全球员工约2.4万人。ADI助力创新者不断超越一切可能。更多信息,请访问 www.analog.com/cn

Safe Harbor Notice (ASE)

This press release contains "forward‐looking statements" within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended. Although these forward‐looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward‐looking statements, which apply only as of the date of this press release. The words “anticipate,” “believe,” “estimate,” “expect,” “intend,” “plan” and similar expressions, as they relate to us, are intended to identify these forward‐looking statements in this press release. These forward‐looking statements are necessarily estimates reflecting the best judgment of our senior management and our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied by the forward‐looking statements for reasons including, among others, risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the strained relationship between the Republic of China and the People’s Republic of China; general economic and political conditions; the recent shift in United States trade policies; possible disruptions in commercial activities caused by natural or human‐induced disasters; fluctuations in foreign currency exchange rates; and other factors. For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including the 2024 Annual Report on Form 20‐F filed on March 27, 2025.

Forward-Looking Statements (Analog Devices)

This press release contains forward-looking statements, which address a variety of subjects including, for example, statements regarding strategic collaboration, the sale and purchase of the Penang, Malaysia Facility, a long-term supply agreement, planned investments, opportunities for employees, future growth and innovation, expectations for definitive agreements, and other future events. Statements that are not historical facts, including statements about ADI’s beliefs, plans and expectations, are forward-looking statements. Such statements are based on ADI’s current expectations and are subject to a number of factors and uncertainties, which could cause actual results to differ materially from those described in the forward-looking statements. The following important factors and uncertainties, among others, could cause actual results to differ materially from those described in these forward-looking statements: economic, political, legal and regulatory uncertainty or conflict, changes in demand for semiconductor products; ASE’s ability to meet its business expectations in light of the transactions contemplated by this press release; manufacturing delays, product and raw materials availability and supply chain disruptions; changes in export classifications; development of technologies and research and development investments; future liquidity, capital needs and capital expenditures; ability to compete successfully in the markets in which we operate; ability to recruit and retain key personnel; and risks related to acquisitions or other strategic transactions, including the sale and purchase of the Penang, Malaysia facility. For additional information about factors that could cause actual results to differ materially from those described in the forward-looking statements, please refer to ADI’s filings with the Securities and Exchange Commission, including the risk factors contained in ADI’s most recent Annual Report on Form 10-K. Forward-looking statements represent management's current expectations and are inherently uncertain. Except as required by law, ADI does not undertake any obligation to update forward-looking statements made by ADI to reflect subsequent events or circumstances.

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