HMC395-DIE

NOT RECOMMENDED FOR NEW DESIGNS

InGaP HBT Gain Block Amplifier Chip, DC - 4 GHz

Part Models: 2
1ku List Price: price unavailable

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Overview

Gain: 15 dB
P1dB Output Power: +16 dBm
Stable Gain Over Temperature
50 Ohm I/O’s
Small Size: 0.38 x 0.58 x 0.1 mm

The HMC395 die is a GaAs InGaP Heterojunction Bi-polar Transistor (HBT) Gain Block MMIC DC - 4 GHz amplifier. This amplifier die can be used as either a cascadable 50 Ohm gain stage or to drive the LO of HMC mixers with up to +17dBm output power. The HMC395 offers 16 dB of gain and an output IP3 of +31dBm while requiring only 54mA from a +5V supply.

The Darlington feedback pair used results in reduced sensitivity to normal process variations and yields excellent gain stability over temperature while requiring a minimal number of external bias components. The HMC395 can easily be integrated into Multi-Chip-Modules (MCMs) due to its small (0.22mm²) size. All data is with the chip in a 50 Ohm test fixture connected via 0.025mm (1mil) diameter wire bonds of minimal length 0.5mm (20mils).

Applications

Microwave & VSAT Radios
Test Equipment
Military EW, ECM, C³I
Space Telecom

Part Models: 2
1ku List Price: price unavailable

Documentation

Data Sheet 1

HMC395 InGaP HBT Gain Block MMIC Amplifier, DC - 4 GHz Data Sheet 05/15/2023

Application Note 3

Thermal Management for Surface Mount Components General Application Note 11/11/2015

AN-2591: When It Comes to Long-Term Reliability of RF Amplifier ICs, Focus First on Die Junction Temperature 08/05/2024

AN-1604: Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages 08/01/2019

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC395	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC395-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jun 28, 2023 - 23_0127 HMC395/HMC405 Die and Data Sheet Revision
		PCN23_0127_Form Material_Report Revised Datasheet Specification Revised Datasheet Specification
HMC395
HMC395-SX
Sep 29, 2025 - 25_0079 Obsolescence of GCS P1HBT Process
		PDN25_0079_Form Material_Report
HMC395
HMC395-SX

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

ADIsimRF

ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.

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S-Parameter 1

HMC395 S-Parameters

Sys-Parameter Models for Keysight Genesys

Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.

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