Features and Benefits
- Passive: no dc bias required
- High IIP3: 20 dBm typical
- LO to RF isolation: 25 dB typical
- LO to IF isolation: 20 dB typical
- RF to IF isolation: 15 dB typical
- IF bandwidth: dc to 4 GHz
- Downconverter applications
- 3 mm × 3 mm, 12-terminal leadless chip carrier package
The HMC1048ALC3B is a general-purpose, monolithic microwave integrated circuit (MMIC), double-balanced, mixer that can be used as a downconverter with dc to 4 GHz at the intermediate frequency (IF) port and 2.25 GHz to 18 GHz at the radio frequency (RF) port. The mixer requires no external components or matching circuitry.
The HMC1048ALC3B provides excellent local oscillator (LO) to RF, LO to IF, and RF to IF isolation. The mixer operates with LO drive levels from 9 dBm to 17 dBm. The HMC1048ALC3B eliminates the need for wire bonding and allows the use of surface-mount manufacturing techniques.
- Ka band transponders
- Point to multi point radios and very small aperture terminal (VSAT)
- Test equipment and sensors
- Military end use
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
The evaluation board uses 4-layer construction with a copper thickness of 0.5 oz (0.7 mil) and dielectric materials between each copper layer.
All RF traces are routed on Layer 1 and all other remaining layers are grounded planes that provide a solid ground for RF transmission lines. The top dielectric material are Rogers 4350, offering low loss performance. The prepreg material in the middle is used to stick core layers together, which are RoHS compliant ISOLA 370HR layer with copper traces above and below. Both prepreg and the ISOLA 370HR core layer are used to achieve the required board finish thickness.
The RF transmission lines were designed using a coplanar waveguide (CPWG) model with a width of 18 mil and ground spacing of 13 mil for a characteristic impedance of 50 Ω. For optimal RF and thermal grounding, as many plated through vias as possible are arranged around the transmission lines and under the exposed pad of the package.
Since the HMC1048ALC3B is a passive device, there is no requirement for external components. The LO and RF pins are internally ac-coupled. The IF pin is internally dc-coupled. Use an external series capacitor when IF operation is not required. Choose a value that stays within the necessary IF frequency range. When IF operation to dc is required, do not exceed the IF source and sink current rating specified in the Absolute Maximum Ratings section.
Tools & Simulations
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.
Sample & Buy
The USA list pricing shown is for BUDGETARY USE ONLY, shown in United States dollars (FOB USA per unit for the stated volume), and is subject to change. International prices may differ due to local duties, taxes, fees and exchange rates. For volume-specific price or delivery quotes, please contact your local Analog Devices, Inc. sales office or authorized distributor. Pricing displayed for Evaluation Boards and Kits is based on 1-piece pricing.