Complete, system-level solutions for condition monitoring applications will be key to enabling higher quality data and insights, thereby significantly improving manufacturing processes. Advances in 10BASE-T1L/Ethernet-APL, coupled with a real-time, AI-driven sensing technology such as ADI OtoSense™, can enable AI integration at all levels of customer systems. The ADI OtoSense platform senses and interprets any sound, vibration, pressure, current, or temperature to provide continuous, condition-based monitoring and on-demand diagnostics. It operates on the field asset at the edge, in real time, both online and offline. The ADI OtoSense system detects anomalies and learns from interaction with condition monitoring domain experts while creating a digital fingerprint to help identify faults in a machine so it can predict breakdowns before they cause costly downtime, damage, or catastrophic failure.
Advancements in sensing, signal processing, connectivity, mechanical packaging techniques, and artificial intelligence at the edge are enabling new condition monitoring solutions and predictive maintenance services that will unlock significant savings and productivity improvements.
New system-level solutions for condition monitoring applications will include MEMS sensors for vibration and shock detection, precision converter technologies for data acquisition, and edge processing to create high quality asset health data. Low power, robust wired and wireless communication solutions provide access to the asset health data from the asset. Wireless communication solutions include SmartMesh® or Wireless HART®. Wired communications solutions include RS-485 or 10BASE-T1L single pair Ethernet that provides power and data on two wires. These technologies along with high performance power management are combined in asset monitoring solutions (such as OtoSense technology), which are complete hardware and AI monitoring solutions that can be mounted on equipment for predictive maintenance (see Figure 4).