Multi-Channel System Improvements Using Hardened DSP in Digitizer ICs
Increasing multi-channel receive and transmit densities on monolithic integrated circuits (ICs) have enabled exciting new architectural analyses with regards to the design of phased arrays, radars, electronic warfare, and satellite communication systems. However, this increased density requires that systems designers analyze the architectural trade-offs in terms of power consumption, complexity, dynamic range performance and overall system cost. This webinar addresses, using measured results, how the use of hardened digital signal processing (DSP) blocks residing on digitizer ICs, instead of those similar blocks residing in an FPGA, result in dramatic system-level improvements.
Principal Electrical Design Engineer
Mike Jones is a principal electrical design engineer with Analog Devices working in the Aerospace and Defense Business Unit in Greensboro, North Carolina. He joined Analog Devices in 2016. From 2007 until 2016 he worked at General Electric in Wilmington, North Carolina, as a microwave photonics design engineer working on microwave and optical solutions for the nuclear industry. He received his B.S.E.E. and B.S.C.P.E. degrees from North Carolina State University in 2004 and his M.S.E.E. degree from North Carolina State University in 2006.