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For applications that push the boundaries of extreme temperature, whether it is steering an oil drill operating a mile underground or making precision measurements on a jet engine, specialized high temperature electronics solutions are required to ensure performance and reliability. For these and other harsh-environment applications, ADI offers products designed for extreme temperatures, with a portfolio qualified at 175°C and 210°C.

ADI has developed unique capabilities to meet the demands of high temperature applications, including:

  • Advanced design techniques
  • Robust silicon processes
  • Innovative packaging
  • Comprehensive qualification and test

This capability enables us to develop products that must have high performance, high reliability, small footprint and low power in extreme harsh, high temperature environments.

High Temperature

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Technology Enabling High Temperature Products



Standard integrated circuits are typically only designed and specified for a maximum operating temperature of 125°C. Beyond that, many factors can decrease performance and reliability with exposure to extreme temperature. For example, exponentially increasing substrate leakage current and variation of device parameters over temperature can significantly degrade performance. Reliability can be compromised by silicon level concerns such as electromigration and by package level issues such as wire bond wear out. In order to overcome these challenges, products in ADI’s high temperature portfolio have been designed and qualified for high temperature operation using innovative silicon processes, packaging, and test technologies.

Silicon Process

One enabling silicon technology utilized on several ADI  HT products is our silicon‐on-insulator (SOI) bipolar process. In the diagram below, we compare a typical NPN transistor on a normal junction isolated (JI) bipolar process with the SOI process. The arrows on JI process depict the paths for current leakage within the device and also the parasitic paths for current leakage to the substrate (shown in black arrows).
As temperature increases, the effects current leakage increases exponentially, significantly degrading the performance of the device. The SOI process uses a insulating dielectric layer of SiO2 which blocks parasitic current flow in the substrate. By eliminating this parasitic leakage path, device performance can be maintained to very high temperatures.


Figure 5

Advanced Packaging


Another enabling technology for package reliability at high temperature is ADI’s specialized wire bond process for HT plastic packages. Normal gold/aluminum wire bonds will degrade over temperature with formation of intermetallic compounds that are brittle and form voids and weaken the strength of the bond. This can happen in as little as several hundred hours. Our HT plastic packages utilize an additional metallization step with NiPdAu (shown at tile) in order to have a gold bond pad surface, which together with a gold wire create a mono‐metallic bond that will not form intermetallics. The graphic below shows the reliability improvements gained with this technology — the standard Au/Al bond on the tile has significant voiding and intermetallic formation at 500 hours, while the bond with the NiPdAu metallization process on the right maintains integrity with over 6000 hours of high temperature exposure.

Advanced Packaging Nickle Palladium


Au/Al wire bond post 500 hours at 195°C

Advanced Packaging AuAi Posts

Au/Au wire bond with NiPdAu barrier post 6000 hours at 195°C

Advanced Packaging AuOPMi Bond

Reliability Qualification

Reliability Qualification

ADI’s process flow for HT products includes a comprehensive reliability qualification program tailored to the needs of high temperature applications. All HT products are qualified with the High Temperature Operating Life (HTOL) test, which is performed to JEDEC JESD22‐A108 specifications. A minimum of three assembly lots for each product are tested at maximum temperature for a minimum of 1000 hours and ensured to meet datasheet specifications. In addition to this and other qualification tests, robustness tests such as Latch-up immunity, MIL-STD-883 Group-D Mechanical, and ESD are also performed. Reliability reports for high temp portfolio products are available upon request.

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