[Options]
CreateSolderLayers=0
SolderOversize=0
DynamicShapes=0
SkipTeardrops=0
SuppressConstraintTranslation=0
CreateThermalAntiPad=0
AntiPadOversize=10.000
ThermalPadOversize=10.000
SpokeWidth=10.000
[Line Map]
0=BOARD GEOMETRY|ALL
1=ETCH|TOP
2=ETCH|Inner Layer 2
3=ETCH|Inner Layer 3
4=ETCH|BOTTOM
21=BOARD GEOMETRY|SOLDERMASK_TOP
26=BOARD GEOMETRY|SILKSCREEN_TOP
28=BOARD GEOMETRY|SOLDERMASK_BOTTOM
29=BOARD GEOMETRY|SILKSCREEN_BOTTOM
[Copper Map]
0=BOARD GEOMETRY|ALL
1=ETCH|TOP
2=ETCH|Inner Layer 2
3=ETCH|Inner Layer 3
4=ETCH|BOTTOM
[Text Map]
0=BOARD GEOMETRY|ALL
1=ETCH|TOP
2=ETCH|Inner Layer 2
3=ETCH|Inner Layer 3
4=ETCH|BOTTOM
21=BOARD GEOMETRY|SOLDERMASK_TOP
26=BOARD GEOMETRY|SILKSCREEN_TOP
28=BOARD GEOMETRY|SOLDERMASK_BOTTOM
29=BOARD GEOMETRY|SILKSCREEN_BOTTOM
[Decal Map]
0=PACKAGE GEOMETRY|SILKSCREEN_TOP
1=PACKAGE GEOMETRY|SILKSCREEN_TOP
21=PACKAGE GEOMETRY|SOLDERMASK_TOP
22=PACKAGE GEOMETRY|PASTEMASK_BOTTOM
23=PACKAGE GEOMETRY|PASTEMASK_TOP
26=PACKAGE GEOMETRY|SILKSCREEN_TOP
27=PACKAGE GEOMETRY|ASSEMBLY_TOP
28=PACKAGE GEOMETRY|SOLDERMASK_BOTTOM
29=PACKAGE GEOMETRY|SILKSCREEN_BOTTOM
30=PACKAGE GEOMETRY|ASSEMBLY_BOTTOM
[Pad Map]
0=ETCH|internal_pad_def
1=ETCH|TOP
2=ETCH|Inner Layer 2
3=ETCH|Inner Layer 3
4=ETCH|BOTTOM
21=PIN|SOLDERMASK_TOP
22=PIN|PASTEMASK_BOTTOM
23=PIN|PASTEMASK_TOP
28=PIN|SOLDERMASK_BOTTOM
[Via Map]
0=VIA CLASS|internal_pad_def
1=VIA CLASS|TOP
2=VIA CLASS|Inner Layer 2
3=VIA CLASS|Inner Layer 3
4=VIA CLASS|BOTTOM
