<font color="66CC00">No_Error</font> 
On errors, Use 'VIP Detail report' to see the Via in Pad locations


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Current via fill fabnote as below:

19. IF PRESENT, ALL BLIND/BURIED VIAS WITH AN ASPECT RATIO <1:1 TO BE PLATED SHUT WITH COPPER WHEN
USED AS VIA-IN PAD OR AS A STACKED VIA. BLIND/BURIED VIAS WITH AN ASPECT RATIO >1:1 TO BE FILLED
WITH NON-CONDUCTIVE EPOXY. UNLESS OTHERWISE SPECIFIED.

Epoxy Fill Note:
( )  NON-CONDUCTIVE EPOXY. FILL AND CAP ALL 0.XXXX INCH DRILLED VIAS.

Silver Fill Note:
( )  SILVER. FILL AND CAP ALL 0.XXXX INCH DRILLED VIAS.
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<font color="Blue">Note:
FAB Note#19 Covers all Blind/Buried Via fill requirements.
FAB Note#20 to be used for Through Hole via fill requirements with the Fill type and Drill values.
<b>On TOPHAT Designs, The vias in TOPHAT region (i.e, Via Start from TOP Layer to TH_ENDLAYER) irrespective of use as VIP or dog-bone need to be filled using  NON-CONDUCTIVE EPOXY, Use FAB Note#20 for TOPHAT via fill instructions.</b> </font>


<h2>Below are the Via fill scenarios for Reference:</h2>
<img src="C:/Users/ABRAHA~1.DIM/AppData/Local/Temp/viafillscenarios/viafill_scenarios.png" border="0"> <br />