

Special instructions for DS33zXYDK02A0:
1.	Silk screen top and bottom white with supplied artwork.
2.	Copper external / internal 0.5 ounce. External plated to 1 ounce.
3.	Hole sizes are finished size.  Tolerance is shown in drill.art
4.	Finish: LPI Soldermask, color BLUE, with exposed copper areas plated with standard 3-8 micro inches immersion gold over 100 minimum micro inches electroless nickel.
5.	Material FR4, dielectric constant 4.5.
6.      Build / Manufacture to best commercial standards.
7.	Required stackup shown at end of this file
8.    	Clip silkscreen if needed, based on soldermask (not pad-etch).




Enclosed files:
1)	Top.art		Top layer positive image artwork.
2)	L2*.art through L5*.art	Layer 2 to Layer 5 positive image artwork (respectively)
3)	Bottom.art	Bottom layer positive image artwork.
4)	silk_T.art	Top layer silk screen.
5)	silk_B.art	Bottom layer silk screen.
6)	sdr_m_t.art Top layer Soldermask.
7)	sdr_m_b.art Bottom layer Soldermask.
8)	Drill.art	Drill chart and board dimension.
9)	ncdrill1-6.tap	
10)	ncdrill.log
11) 	nc_param.txt
12)	dimension.art	Outline / Dimension


	
----------------------Stackup +- 10 %---------------------------------

Etch - Top (Signal)	
  			Separation	7 Mil
Etch - L2  (Plane)	
  			Separation	14 Mil	
Etch - L3  (Signal)	
  			Separation	38 Mil		
Etch - L4  (Signal)	
  			Separation	14 Mil		
Etch - L5  (Plane)	  			
  			Separation	7 Mil		
Etch - Bot (Signal)